X28HC64J-12 Intersil, X28HC64J-12 Datasheet - Page 2

• Manufacturer Part Number: X28HC64J-12
• Description: IC EEPROM 64KBIT 120NS 32PLCC
• Manufacturer: Intersil

Specifications of X28HC64J-12

• Format - Memory: EEPROMs - Parallel
• Memory Type: EEPROM
• Memory Size: 64K (8K x 8)
• Speed: 120ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-LCC (J-Lead)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Ordering Information
X28HC64J-70*
X28HC64JIZ-70* (Note 1)
X28HC64JZ-70* (Note 1)
X28HC64SIZ-70
X28HC64SZ-70 (Note 1)
X28HC64J-90*
X28HC64JI-90**
X28HC64JIZ-90* (Note 1)
X28HC64P-90
X28HC64PI-90
X28HC64PIZ-90 (Notes 1, 2) X28HC64PI-90 RRZ
X28HC64PZ-90 (Notes 1, 2) X28HC64P-90 RRZ
X28HC64J-12*
X28HC64JI-12*
X28HC64JIZ-12* (Note 1)
X28HC64JZ-12* (Note 1)
X28HC64P-12
X28HC64PI-12
X28HC64PIZ-12 (Notes 1, 2) X28HC64PI-12 RRZ
X28HC64PZ-12 (Notes 1, 2) X28HC64P-12 RRZ
X28HC64S-12*
X28HC64SI-12*
X28HC64SIZ-12* (Note 1)
X28HC64SZ-12 (Note 1)
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
***Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
applications.
PART NUMBER
,
**
X28HC64J-70 RR
X28HC64JI-70 ZRR
X28HC64J-70 ZRR
X28HC64SI-70 RR
X28HC64S-70 RRZ
X28HC64J-90 RR
X28HC64JI-90 RR
X28HC64JI-90 ZRR
X28HC64P-90 RR
X28HC64PI-90 RR
X28HC64J-12 RR
X28HC64JI-12 RR
X28HC64JI-12 Z RR
X28HC64J-12 RRZ
X28HC64P-12 RR
X28HC64PI-12 RR
X28HC64S-12 RR
X28HC64SI-12 RR
X28HC64SI-12 RRZ
X28HC64S-12 RRZ
2
PART MARKING
TEMPERATURE
RANGE (°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
X28HC64
ACCESS TIME
(ns)
120
70
90
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC (Pb-free)
28 Ld SOIC (300 mil)
28 Ld SOIC (300 mil) (Pb-free)
32 Ld PLCC
32 Ld PLCC
32 Ld PLCC (Pb-free)
28 Ld PDIP
28 Ld PDIP
28 Ld PDIP (Pb-free)
28 Ld PDIP (Pb-free)
32 Ld PLCC
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC (Pb-free)
28 Ld PDIP
28 Ld PDIP
28 Ld PDIP (Pb-free)
28 Ld PDIP (Pb-free)
28 Ld SOIC (300 mil)
28 Ld SOIC (300 mil)
28 Ld SOIC (300 mil) (Pb-free)
28 Ld SOIC (300 mil) (Pb-free)
PACKAGE
M28.3
N32.45x55
N32.45x55
N32.45x55
M28.3
M28.3
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
E28.6
E28.6
N32.45x55
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
E28.6
E28.6
M28.3
M28.3
M28.3
August 28, 2009
DWG. #
PKG.
FN8109.2