3059Y-1-500LF Bourns Inc., 3059Y-1-500LF Datasheet - Page 13

• Manufacturer Part Number: 3059Y-1-500LF
• Description: TRIMPOT 50 OHM 1.25"REC CER MT
• Manufacturer: Bourns Inc.
• Series: 3059 - Sealedr

Specifications of 3059Y-1-500LF

• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 50
• Termination Style: PC Pin
• Power (watts): 1W
• Tolerance: ±10%
• Number Of Turns: 22
• Adjustment Type: Side Adjustment
• Resistive Material: Cermet
• Mounting Type: Chassis Mount
• Package / Case: Rectangular - 1.250" L x 0.190" W x 0.315" H (31.75mm x 4.83mm x 8.00mm)
• Track Resistance: 50ohm
• No. Of Turns: 22
• Resistance Tolerance: ± 10%
• Power Rating: 1W
• Potentiometer Mounting: Through Hole
• Resistance: 50 Ohms
• Operating Temperature Range: - 55 C to + 150 C
• Element Type: Cermet
• Dimensions: 6.10 mm W x 31.75 mm L
• Product: Trimmers
• Taper: Linear
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Electrical Characteristics
Current Handling .......................................................................3 A, track width 1 mm
ESD (Contact)......................................................................................... ±8 kV, 10 times
ESD (Air)............................................................................................... ±15 kV, 10 times
Conductivity ...............................................................................1.6 µ ·cm, 1 oz copper
RF Capability ...............................................................................................up to 10 GHz
Environmental Characteristics
Temperature Cycling ...............................................................................-40 °C/+100 °C
Air Temperature Low.................................................................................-25 °C; 24 hrs
Air Temperature High...............................................................................+70 °C; 24 hrs
Humidity...................................................................................+85 °C; 85 % RH; 96 hrs
Thermal Shock .....................................................................-40 °C to +85 °C; 24 cycles
Physical Characteristics
Vibration Shock ..........................................................................................................30 G
Wear Resistance................................................................................20,000 cycles, 0.8 N
Peel Test .......................................................................................................................20 N
Pull Test .....................................................................................................................10 kN
Shear Test .......................................................................................40 N (0805; SOD123)
Solderability............................................................................................................
Lithium Salt Test..........................................................................................................Pass
Halt Test........................................................................................................................Pass
Wirebondable ................................................................................................................Yes
Weldable .........................................................................................................................Yes
Recyclable.......................................................................................................................Yes
Physical Characteristics
Min. Dimensions .................................................................................................
Wall Thickness ..................................................................................................
Track Width .........................................................................................................
Plating Composition........................................................................Cu, Ni, Sn/Pb & Au
Plating Thickness.............................................................................................2 to 50 µm
3-D Shapes .....................................................................................................................Yes
3-D MID Devices
Bourns is also applying our thick-film printing capabilities
to manufacture 3-D Molded Interconnect Devices (MIDs),
which integrate the housing with the circuit board. Two
advantages are board size and reduction of piece parts.
Applications include high frequency connectors, security
housings, antennas and EMC screening.
0.5 mm
70 µm
5 mm
95 %
Specifications are typical and dependent on
the manufacturing method, materials, size
and shape of the part.
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