PCA82C251TD NXP Semiconductors, PCA82C251TD Datasheet
PCA82C251TD
Specifications of PCA82C251TD
Related parts for PCA82C251TD
PCA82C251TD Summary of contents
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PCA82C251 CAN transceiver for 24 V systems Rev. 04 — 28 January 2010 1. General description The PCA82C251 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and ...
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... NXP Semiconductors 5. Ordering information Table 2. Ordering information Type number Package Name PCA82C251T SO8 6. Block diagram Fig 1. 7. Pinning information 7.1 Pinning Fig 2. PCA82C251_4 Product data sheet Description plastic small outline package; 8 leads; body width 3 TXD 8 SLOPE/ Rs STANDBY 4 RXD RECEIVER 5 REFERENCE V ref ...
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... NXP Semiconductors 7.2 Pin description Table 3. Symbol TXD GND V CC RXD V ref CANL CANH Rs 8. Functional description The PCA82C251 is the interface between a CAN protocol controller and the physical bus primarily intended for applications MBd in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller fully compatible with the “ ...
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... NXP Semiconductors LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slower in Standby mode, the first message will be lost at higher bit rates. Table 4. Supply 4 5 5.5 V 4.5 V < < V [1] If another bus node is transmitting a dominant bit, then RXD is logic 0. ...
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... NXP Semiconductors 10. Thermal characteristics Table 7. Symbol R th(j-a) 11. Characteristics Table 8. Characteristics − ° 4 5 amb ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only ° 100 % tested at +25 C. Symbol Parameter Supply I supply current 3 DC bus transmitter ...
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... NXP Semiconductors Table 8. Characteristics …continued − ° 4 5 amb ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only ° 100 % tested at +25 C. Symbol Parameter V differential input hysteresis diff(hys) V HIGH-level output voltage OH V LOW-level output voltage ...
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... NXP Semiconductors Fig 3. Fig 4. Fig 5. PCA82C251_4 Product data sheet +5 V TXD 1 V ref 5 PCA82C251 RXD 4 2 GND 30 pF Test circuit for dynamic characteristics. V TXD 0 diff V RXD 0.3V t onTXD t onRXD Timing diagram for dynamic characteristics. V RXD hysteresis 0.5 Hysteresis. Rev. 04 — 28 January 2010 ...
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... NXP Semiconductors Fig 6. Fig 7. Fig 8. PCA82C251_4 Product data sheet RXD TXD Timing diagram for wake-up from Standby. V diff V RXD TXD Timing diagram for bus dominant to RXD LOW. 100 TXD 1 V ref PCA82C251 5 RXD GND Rs 47 kΩ The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses and 3b ...
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... NXP Semiconductors 12. Application information (1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, ( slope control is desired: R Fig 9. PCA82C251_4 Product data sheet P8xC592 CAN-CONTROLLER CTX0 CRX0 TXD RXD PCA82C251 CAN-TRANSCEIVER CANH CAN BUS 120 Ω LINE dominant = LOW ext PCA82C251 CAN transceiver application diagram Rev. 04 — ...
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... NXP Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 11. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA82C251_4 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature MSL: Moisture Sensitivity Level Rev. 04 — ...
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... PCA82C251_4 20100128 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP8 package discontinued; bare die no longer available. • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 5 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 Soldering of SMD packages ...