DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 226
DSPIC30F2010-30I/SPG
Manufacturer Part Number
DSPIC30F2010-30I/SPG
Description
16BIT 30MIPS DSPIC, 30F2010, DIP28
Manufacturer
Microchip Technology
Series
DsPIC30Fr
Datasheet
1.DSPIC30F2010-30ISPG.pdf
(244 pages)
Specifications of DSPIC30F2010-30I/SPG
Core Frequency
30MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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dsPIC30F
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
DS70082E-page 224
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
β
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
A
E
D
B
α
n
p
L
c
β
Advance Information
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.430
.022
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
2004 Microchip Technology Inc.
MILLIMETERS
p
α
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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