LPC1114FHN33/301 NXP Semiconductors, LPC1114FHN33/301 Datasheet - Page 3

• Manufacturer Part Number: LPC1114FHN33/301
• Description: MCU, 32BIT, 32KFLASH, CORTEX-M0, 33HVQFN
• Manufacturer: NXP Semiconductors

Specifications of LPC1114FHN33/301

• Controller Family/series: ARM Cortex-M0
• No. Of I/o's: 28
• Ram Memory Size: 8KB
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Core Size: 32bit
• Program Memory Size: 32KB
• Oscillator Type: External, Internal
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
4. Ordering information
Table 1.
[1]
LPC1111_12_13_14
Product data sheet
Type number
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1112FHN33/101
LPC1112FHN33/102
LPC1112FHN33/201
LPC1112FHN33/202
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/301
LPC1113FHN33/302
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
LPC1113FBD48/301
LPC1113FBD48/302
LPC1114FBD48/301
LPC1114FBD48/302
LPC1114FA44/301
LPC1114FA44/302
Sampling in Q2 2011.
Ordering information
[1]
[1]
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
PLCC44
PLCC44
All information provided in this document is subject to legal disclaimers.
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 ×
1.4 mm
PLCC44; plastic leaded chip carrier; 44 leads
PLCC44; plastic leaded chip carrier; 44 leads
Rev. 4 — 10 February 2011
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
© NXP B.V. 2011. All rights reserved.
Version
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
sot313-2
sot313-2
sot313-2
sot313-2
sot187-2
sot187-2
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