LPC1227FBD64/301 NXP Semiconductors, LPC1227FBD64/301 Datasheet - Page 30
![MCU, 128K FLASH, CORTEX-M0, 64LQFP](/photos/19/1/190186/ge64lqfp05-40_sml.jpg)
LPC1227FBD64/301
Manufacturer Part Number
LPC1227FBD64/301
Description
MCU, 128K FLASH, CORTEX-M0, 64LQFP
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1224FBD48201.pdf
(60 pages)
Specifications of LPC1227FBD64/301
Rohs Compliant
YES
Featured Product
LPC122x Cortex-M0 Microcontrollers
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
45MHz
Connectivity
I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
55
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Controller Family/series
LPC1200
No. Of I/o's
55
Ram Memory Size
8KB
Cpu Speed
30MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5164
LPC1227FBD64/301
LPC1227FBD64/301
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1227FBD64/301
Manufacturer:
NXP
Quantity:
5 000
Company:
Part Number:
LPC1227FBD64/301
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1227FBD64/301
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1227FBD64/301,1
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC122X
Objective data sheet
Symbol
R
R
T
DD
j(max)
th(j-a)
th(j-c)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to case
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
j
•
•
•
=
T
R
P
40
amb
T
D
th(j-a)
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
JEDEC test board; no
air flow
JEDEC test board
C unless otherwise specified.
R
LQFP64 package
LQFP48 package
LQFP64 package
LQFP48 package
th j a
Rev. 1.2 — 29 March 2011
–
j
(C), can be calculated using the following
Min
-
-
-
DD
32-bit ARM Cortex-M0 microcontroller
and V
DD
Typ
61
86
19
36
-
. The I/O power dissipation of
Max
-
-
-
-
150
LPC122x
© NXP B.V. 2011. All rights reserved.
Unit
C/W
C/W
C/W
C/W
C
30 of 60
(1)