DSPIC30F1010-20E/SO Microchip Technology, DSPIC30F1010-20E/SO Datasheet - Page 273
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F1010-20E/SO
Manufacturer Part Number
DSPIC30F1010-20E/SO
Description
6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in T
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F1010-20E/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F1010-20E/SO
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F1010-20E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- AC164335 PDF datasheet
- DM300023 PDF datasheet #2
- DM300023 PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20IP PDF datasheet #5
- DSPIC30F1010-30ISO PDF datasheet #6
- DSPIC30F1010-30ISO PDF datasheet #7
- Current page: 273 of 286
- Download datasheet (5Mb)
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-076
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
D1
n1
A1
E1
F
E
D
B
n
p
A
L
c
n
MIN
.037
.390
.390
.004
.039
.002
.018
.463
.463
.012
.025
2
1
Preliminary
0
5
5
D1
L
.039 REF.
CH x 45°
INCHES
D
NOM
.031
44
11
.004
.394
.394
.043
.039
.024
.472
.472
.006
.015
.035
A1
3.5
10
10
dsPIC30F1010/202X
A
F
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.30
0.64
0.09
0
5
5
MILLIMETERS*
1.00 REF.
NOM
12.00
12.00
10.00
10.00
1.10
1.00
0.10
0.15
0.38
0.60
0.89
Revised 07-22-05
3.5
10
10
0.80
44
11
A2
DS70178C-page 271
MAX
12.25
12.25
10.10
10.10
0.44
1.14
1.20
1.05
0.15
0.75
0.20
15
15
7
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