DSPIC30F1010-20E/SO Microchip Technology, DSPIC30F1010-20E/SO Datasheet - Page 44
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F1010-20E/SO
Manufacturer Part Number
DSPIC30F1010-20E/SO
Description
6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in T
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F1010-20E/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F1010-20E/SO
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F1010-20E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- AC164335 PDF datasheet
- DM300023 PDF datasheet #2
- DM300023 PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20IP PDF datasheet #5
- DSPIC30F1010-30ISO PDF datasheet #6
- DSPIC30F1010-30ISO PDF datasheet #7
- Current page: 44 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
4.1.2
The three-operand MCU instructions are of the form:
where Operand 1 is always a working register (i.e., the
Addressing mode can only be register direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following Addressing modes are
supported by MCU instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-modified
• Register Indirect Pre-modified
• 5-bit or 10-bit Literal
4.1.3
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
Addressing modes supported by most MCU instruc-
tions, move and accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
In summary, the following Addressing modes are
supported by move and accumulator instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-modified
• Register Indirect Pre-modified
• Register Indirect with Register Offset (Indexed)
• Register Indirect with Literal Offset
• 8-bit Literal
• 16-bit Literal
DS70178C-page 42
Note:
Note:
Note:
Operand 3 = Operand 1 <function> Operand 2
MCU INSTRUCTIONS
Not all instructions support all the
Addressing modes given above. Individual
instructions may support different subsets
of these Addressing modes.
MOVE AND ACCUMULATOR
INSTRUCTIONS
For the MOV instructions, the Addressing
mode specified in the instruction can differ
for the source and destination EA. How-
ever, the 4-bit Wb (Register Offset) field is
shared
destination (but typically only used by
one).
Not all instructions support all the
Addressing modes given above. Individual
instructions may support different subsets
of these Addressing modes.
between
both
source
and
Preliminary
4.1.4
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
Addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will always be directed to the
Y AGU. The effective addresses generated (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
In summary, the following Addressing modes are
supported by the MAC class of instructions:
• Register Indirect
• Register Indirect Post-modified by 2
• Register Indirect Post-modified by 4
• Register Indirect Post-modified by 6
• Register Indirect with Register Offset (Indexed)
4.1.5
Besides the various Addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
Note:
MAC INSTRUCTIONS
Register Indirect with Register Offset
Addressing is only available for W9 (in X
space) and W11 (in Y space).
OTHER INSTRUCTIONS
© 2006 Microchip Technology Inc.
Related parts for DSPIC30F1010-20E/SO
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![MA300012](/photos/26/93/269359/ma300012_tmb.jpg)
Part Number:
Description:
MODULE DSPIC30F SAMPLE 64QFP
Manufacturer:
Microchip Technology
Datasheet:
![MA300013](/photos/26/93/269388/ma300013_tmb.jpg)
Part Number:
Description:
MODULE DSPIC30F SAMPLE 80QFP
Manufacturer:
Microchip Technology
Datasheet:
![SW006013](/photos/9/32/93254/sw006013_tmb.jpg)
Part Number:
Description:
MPLAB C Compiler For DsPIC DSCs
Manufacturer:
Microchip Technology
Datasheet:
![DAF30-3](/photos/26/88/268854/daf30_3_tmb.jpg)
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
![DAF30-4](/photos/26/91/269107/daf30_4_tmb.jpg)
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
![DAF30-2](/photos/26/92/269222/daf30_2_tmb.jpg)
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
![MA18F4431](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
MODULE PLUG-IN PIC18F4431
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F2020-20E/SO](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 12KB 40MHZ, 5.5V, SOIC28
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F3014-20I/PT](/photos/6/82/68251/c04-076_pt_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 24KB 40MHZ, 5.5V, TQFP44
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F4011-20E/P](/photos/6/61/66192/150-40-dip_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 48KB, 40MHZ, 5.5V, DIP40
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F4012-20I/SO](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 48KB 20MHZ, 5.5V, SOIC28
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F5011-20I/PTG](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 66KB, 40MHZ 5.5V TQFP-64
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F2012-30I/ML](/photos/6/81/68120/150-28-qfn_tmb.jpg)
Part Number:
Description:
IC, DSC, 16BIT, 12KB, 40MHZ, 5.5V, QFN28
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F2010-30I/SPG](/photos/19/0/190081/42268255_tmb.jpg)
Part Number:
Description:
16BIT 30MIPS DSPIC, 30F2010, DIP28
Manufacturer:
Microchip Technology
Datasheet:
![DSPIC30F5011-30I/PTG](/photos/19/3/190367/42268274_tmb.jpg)
Part Number:
Description:
16BIT MCU-DSP 30MHZ, SMD, 30F5011
Manufacturer:
Microchip Technology
Datasheet: