C500TS502 Omron, C500TS502 Datasheet - Page 16

• Manufacturer Part Number: C500TS502
• Description: RTD INPUT MODULE
• Manufacturer: Omron

Specifications of C500TS502

• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Installation Requirements
Installation Requirements
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Installation Requirements
Signal Requirements
Power Consumption
Module Locations
Wiring Practices
Before setting input ranges, make sure to review the application require-
ments, temperature ranges, and input cable configuration. RTD probes usu-
ally have three signal wires but may also have two or four. These wires may
be coded by color or length for connection to the proper terminal. Use the
configuration worksheet in Appendix D to record module settings.
The module uses 5 volt power from the PLC power supply. The maximum
current consumption is 1.3 Amps. Refer to the CV Installation Manual W195
to determine total system power requirements.
The module uses the I/O READ/WRITE ladder instruction to communicate
with the PLC’s CPU. Each module has two or four I/O words in the PLC I/O
table. The modules may be located in the following racks:
• CPU Rack
• CV CPU Expansion Rack
• I/O Expansion Rack
• Local Expansion Rack
• SYSMAC BUS/2 I/O Rack
Any number of modules may be inserted into any single backplane. The only
limitations are total system I/O capacity and the maximum power from the
backplane. A maximum of eight 2-word modules can be mounted in a CPU
or CPU Expansion Rack. Refer to Installation Manual W195 for the current
limitation of the power supply modules. Refer to the following chart as a
guide to the number of modules that can be placed in the rack.
The following practices are recommended when routing and connecting
wires to the module:
• Always use the shortest possible cables.
• Avoid placing low voltage wire (i.e. analog input cables) parallel to high-en-
• Use wireways for routing. Run signal wires and power wires in separate
• Avoid bending cables into sharp angles.
• Use shielded cables for input signals.
• Do not place wires on vibrating surfaces.
• Connect the shield wire only at the module end of the cable.
CPU rack
CPU expansion
I/O expansion
ergy wire.
wireways or conduit if possible.
CV
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CVM1
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