HSDL-3208-021 Lite-On Electronics, HSDL-3208-021 Datasheet - Page 11

• Manufacturer Part Number: HSDL-3208-021
• Description: Infrared Transceivers IR Transceiver 115Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3208-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 8 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 50 ns, 600 ns
• Maximum Fall Time: 50 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.4 mm x 2.9 mm x 1.8 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Fall Time: 600/50ns
• Rise Time: 600/50ns
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 7
• Operating Temp Range: -25C to 70C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 7mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11
Figure 16. Baking conditions chart.
Moisture Proof Packaging
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
IS NECESSARY
NO BAKING
YES
PERFORM RECOMMENDED
OPENED (UNSEALED)
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
LESS THAN 30°C,
AND LESS THAN
THAN 72 HOURS
ENVIRONMENT
OPENED LESS
PACKAGE IS
PACKAGE IS
PACKAGE
60% RH
YES
NO
NO
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Baking should only be done once.
Recommended Storage
Conditions
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions.
Package
In reels
In bulk
Storage
Temperature
Relative
Humidity
Temp.
60 C
100 C
125 C
150 C
10 C to 30 C
below 60% RH
Time
48 hours
4 hours
2 hours
1 hour