HSDL-3208-021 Lite-On Electronics, HSDL-3208-021 Datasheet - Page 14

• Manufacturer Part Number: HSDL-3208-021
• Description: Infrared Transceivers IR Transceiver 115Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3208-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 8 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 50 ns, 600 ns
• Maximum Fall Time: 50 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.4 mm x 2.9 mm x 1.8 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Fall Time: 600/50ns
• Rise Time: 600/50ns
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 7
• Operating Temp Range: -25C to 70C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 7mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 20. Solder stencil aperture.
Figure 21. Adjacent land keepout and solder mask areas.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
l
APERTURES AS PER
LAND DIMENSIONS
SOLDER MASK
0.2
7.2
Aperture size(mm)
length, l
2.60
3.00
0.05
0.05
w
width, w
0.55
0.55
UNITS: mm
0.05
0.05
t
2.6
3.0