HSDL-3208-021 Lite-On Electronics, HSDL-3208-021 Datasheet - Page 17

• Manufacturer Part Number: HSDL-3208-021
• Description: Infrared Transceivers IR Transceiver 115Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3208-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 8 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 50 ns, 600 ns
• Maximum Fall Time: 50 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.4 mm x 2.9 mm x 1.8 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Fall Time: 600/50ns
• Rise Time: 600/50ns
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 7
• Operating Temp Range: -25C to 70C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 7mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

17
Appendix B: PCB Layout
Suggestion
The HSDL-3208 is a shieldless part
and hence does not contain a shield
trace, unlike the other transceivers.
The following PCB layout guide-
lines should be followed to obtain a
good PSRR and EM immunity,
resulting in good electrical
performance. Things to note:
1. The AGND pin should be
2. C1 and C2 are optional supply
3. VLED can be connected to either
4. Preferably a multi-layered board
connected to the ground plane.
filter capacitors; they may be left
out if a clean power supply is
used.
unfiltered or unregulated power
supply. If VLED and V
the same power supply and C1 is
used, the connection should be
before the current limiting
resistor R2. In a noisy environ-
ment, including capacitor C2 can
enhance supply rejection. C1 is
generally a ceramic capacitor of
low inductance providing a wide
frequency response while C2 is a
tantalum capacitor of big volume
and fast frequency response. The
use of a tantalum capacitor is
more critical on the V
which carries a high current.
should be used to provide
sufficient ground plane. Use the
layer underneath and near the
transceiver module as V
sandwich that layer between
LED
CC
CC
share
line,
, and
The area underneath the module at
the second layer, and 3 cm in all
directions around the module, is
defined as the critical ground plane
zone. The ground plane should be
maximized in this zone. Refer to
application note AN1114 or the
Lite-On IrDA Data Link Design
Guide for details. The layout below
is based on a 2-layer PCB.
Figure 26. PCB layout suggestion.
ground connected board layers.
Refer to the diagram below for
an example of a 4-layer board.
Top View
Bottom View
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
BOTTOM LAYER (GND)