IP3348CX20 NXP Semiconductors, IP3348CX20 Datasheet - Page 12

• Manufacturer Part Number: IP3348CX20
• Manufacturer: NXP Semiconductors

Specifications of IP3348CX20

• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
9. Design and assembly recommendations
IP3348CX5_CX10_CX15_CX20
Product data sheet
9.1 PCB design guidelines
9.2 PCB assembly guidelines for Pb-free soldering
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to
Table 11.
Table 12.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
Fig 15. Pb-free solder reflow profile
Table 11
The device is capable of withstanding at least three reflows of this profile.
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
for the recommended PCB design parameters.
T
reflow(peak)
Rev. 1 — 2 November 2010
Multi channel LC-filter network for high-speed data interfaces
( C)
250
230
217
T
IP3348CX5/CX10/CX15/CX20
preheat
t
1
Value or specification
250 μm
100 μm (0.004 inch)
325 μm
20 μm to 40 μm
AuNi
FR4
Value or specification
325 μm
100 μm (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
see
t
5
Figure 15
t
2
t
t
3
4
cooling rate
001aai943
t (s)
© NXP B.V. 2010. All rights reserved.
12 of 16