PUMB30 T/R NXP Semiconductors, PUMB30 T/R Datasheet
PUMB30 T/R
Specifications of PUMB30 T/R
Related parts for PUMB30 T/R
PUMB30 T/R Summary of contents
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... PEMB30; PUMB30 PNP/PNP double resistor-equipped transistors 2 open Rev. 02 — 2 September 2009 1. Product profile 1.1 General description PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages Table 1. Type number PEMB30 PUMB30 1.2 Features I 100 mA output current capability I Built-in bias resistors I Simplifi ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMB30 PUMB30 4. Marking Table 5. Type number PEMB30 PUMB30 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMB30_PUMB30_2 Product data sheet PNP/PNP double resistor-equipped transistors 2 open Pinning Description GND (emitter) TR1 ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot T stg amb [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per transistor I CBO I CEO I EBO CEsat 500 h FE (1) 400 300 (2) 200 (3) 100 ( 100 C amb ( amb ( amb Fig 1. DC current gain as a function of collector current; typical values PEMB30_PUMB30_2 Product data sheet PNP/PNP double resistor-equipped transistors 2 open ...
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... NXP Semiconductors 8. Package outline 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 3. Package outline SOT363 (SC-88) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PEMB30 ...
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... NXP Semiconductors 10. Soldering Fig 5. 4.5 Fig 6. PEMB30_PUMB30_2 Product data sheet PNP/PNP double resistor-equipped transistors 2 open 2.65 1.5 2.35 0 1.8 Dimensions in mm Reflow soldering footprint SOT363 (SC-88) 1.3 1.3 2.45 5.3 Wave soldering footprint SOT363 (SC-88) Rev. 02 — 2 September 2009 PEMB30 ...
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... NXP Semiconductors 2 1.7 Fig 7. PEMB30_PUMB30_2 Product data sheet PNP/PNP double resistor-equipped transistors 2 open 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. Reflow soldering footprint SOT666 Rev. 02 — 2 September 2009 PEMB30; PUMB30 0.4 0.3 ...
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... Document ID Release date PEMB30_PUMB30_2 20090902 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 3 “Package outline SOT363 (SC-88)” • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Legal information ...