NZH15B,115 NXP Semiconductors, NZH15B,115 Datasheet

DIODE ZENER 500MW 15V SOD123

NZH15B,115

Manufacturer Part Number
NZH15B,115
Description
DIODE ZENER 500MW 15V SOD123
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NZH15B,115

Package / Case
SOD-123
Mounting Type
Surface Mount
Power - Max
500mW
Current - Reverse Leakage @ Vr
40nA @ 11V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Voltage - Zener (nom) (vz)
15V
Impedance (max) (zzt)
16 Ohm
Zener Voltage
15 V
Voltage Tolerance
5 %
Power Dissipation
1 W
Maximum Reverse Leakage Current
0.04 uA
Maximum Zener Impedance
16 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934064371115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
Table 1.
[1]
[2]
[3]
Symbol
V
P
F
tot
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010
Total power dissipation: ≤ 500 mW
Wide working voltage range
General regulation functions
Pulse test: t
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm
Device mounted on a ceramic PCB, Al
Quick reference data
Parameter
forward voltage
total power dissipation
p
≤ 300 μs; δ ≤ 0.02.
2
.
2
O
3
, standard footprint.
Conditions
I
T
F
amb
= 10 mA
≤ 25 °C
Small plastic package suitable for
surface-mounted design
Low differential resistance
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Product data sheet
Max
0.9
500
1
Unit
V
mW
W

Related parts for NZH15B,115

NZH15B,115 Summary of contents

Page 1

NZH series Single Zener diodes Rev. 01 — 27 January 2010 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features Total power dissipation: ≤ 500 mW ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number NZH3V0B to NZH30C [1] The series consists of 25 types with nominal working voltages from 3 Marking Table 4. Type number NZH3V0B NZH3V3A NZH3V6B NZH3V9B NZH4V3B NZH4V7B NZH5V1B ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [2] Device mounted on a ceramic PCB Thermal characteristics Table 6. Symbol ...

Page 4

... NXP Semiconductors Table 8. ° NZHxxx 4V3B 4V7B 5V1B 5V6B 6V2B 6V8B 7V5C 8V2B 9V1B 10C [ MHz; V Table 9. ° NZHxxx 11C 12B 13B 15B 16C 18C 20C [ MHz; V Table 10. ° NZHxxx 22C 24C 27C 30C [ MHz; V NZH_SER_1 Product data sheet Characteristics per type; NZH3V0B to NZH10C C unless otherwise specified ...

Page 5

... NXP Semiconductors = 25 ° Fig 1. Forward current as a function of forward voltage; typical values 50 V (V) = 3.0 Z(nom (mA) 3.3 40 3.6 3.9 5 ° Fig 2. Working current as a function of working voltage; typical values NZH_SER_1 Product data sheet 300 I F (mA) 200 100 0 0.6 0.8 006aac010 (mA) 9 ...

Page 6

... NXP Semiconductors 8. Package outline Fig 4. 9. Packing information Table 11. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package NZH3V0B to NZH30C [1] For further information and the availability of packing methods, see [2] The series consists of 25 types with nominal working voltages from 3 ...

Page 7

... NXP Semiconductors 11. Revision history Table 12. Revision history Document ID Release date NZH_SER_1 20100127 NZH_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 27 January 2010 NZH series Single Zener diodes Supersedes - © NXP B.V. 2010. All rights reserved. ...

Page 8

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 9

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...

Related keywords