CY7C1470BV33-200AXC Cypress Semiconductor Corp, CY7C1470BV33-200AXC Datasheet - Page 16

CY7C1470BV33-200AXC

CY7C1470BV33-200AXC

Manufacturer Part Number
CY7C1470BV33-200AXC
Description
CY7C1470BV33-200AXC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1470BV33-200AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1470BV33-200AXC
Manufacturer:
TI
Quantity:
12 000
Part Number:
CY7C1470BV33-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
2.5 V TAP AC Test Conditions
Input pulse levels................................................V
Input rise and fall time .....................................................1 ns
Input timing reference levels........................................ 1.25 V
Output reference levels ............................................... 1.25 V
Test load termination supply voltage ........................... 1.25 V
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < T
Identification Register Definitions
Scan Register Sizes
Note
Document Number: 001-15032 Rev. *H
V
V
V
V
V
V
I
Revision Number (31:29)
Device Depth (28:24)
Architecture/Memory Type (23:18)
Bus Width/Density (17:12)
Cypress JEDEC ID Code (11:1)
ID Register Presence Indicator (0)
Instruction
Bypass
ID
Boundary Scan Order–165-ball FBGA
Boundary Scan Order–209-ball BGA
14. All voltages refer to V
X
OH1
OH2
OL1
OL2
IH
IL
Parameter
A
Instruction Field
< +70 °C; V
Register Name
SS
Output HIGH Voltage
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Load Current
(GND).
DD
= 2.5 V ± 0.125 V unless otherwise noted)
Description
CY7C1470BV25
00000110100
(2 M × 36)
001000
100100
01011
000
I
I
I
I
V
V
GND  V
1
OH
OH
OL
OL
DDQ
DDQ
= 1.0 mA, V
= 100 A, V
SS
= –1.0 mA, V
= –100 A, V
= 2.5 V
= 2.5 V
to 2.5 V
I
 V
CY7C1472BV25
DDQ
00000110100
Test Conditions
(4 M × 18)
DDQ
DDQ
Bit Size (× 36)
001000
010100
DDQ
DDQ
01011
000
1
= 2.5 V
= 2.5 V
= 2.5 V
= 2.5 V
32
71
2.5 V TAP AC Output Load Equivalent
[14]
3
1
CY7C1472BV25, CY7C1474BV25
CY7C1474BV25
00000110100
TDO
(1 M × 72)
001000
110100
01011
000
1
Bit Size (× 18)
Z = 50Ω
52
32
O
3
1
Describes the version number
Reserved for internal use
Defines
architecture
Defines width and density
Allows
SRAM vendor
Indicates the presence of an ID
register
–0.3
Min
1.7
2.1
1.7
–5
unique
CY7C1470BV25
Description
memory
V
1.25V
DD
Max
0.4
0.2
0.7
Bit Size (× 72)
5
+ 0.3
identification
20pF
50Ω
110
Page 16 of 28
32
3
1
type
Unit
A
V
V
V
V
V
V
and
of
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