CY7C1470BV33-200AXC Cypress Semiconductor Corp, CY7C1470BV33-200AXC Datasheet - Page 21

CY7C1470BV33-200AXC

CY7C1470BV33-200AXC

Manufacturer Part Number
CY7C1470BV33-200AXC
Description
CY7C1470BV33-200AXC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1470BV33-200AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1470BV33-200AXC
Manufacturer:
TI
Quantity:
12 000
Part Number:
CY7C1470BV33-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Switching Characteristics
Over the Operating Range
Notes
Document Number: 001-15032 Rev. *H
18. Timing reference is 1.25 V when V
19. Test conditions shown in (a) of
20. This part has a voltage regulator internally; t
21. t
22. At any supplied voltage and temperature, t
23. This parameter is sampled and not 100% tested.
t
Clock
t
F
t
t
Output Times
t
t
t
t
t
t
t
Setup Times
t
t
t
t
t
t
Hold Times
t
t
t
t
t
t
Power
CYC
CH
CL
CO
OEV
DOH
CHZ
CLZ
EOHZ
EOLZ
AS
DS
CENS
WES
ALS
CES
AH
DH
CENH
WEH
ALH
CEH
MAX
Parameter
steady-state voltage.
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve
High Z before Low Z under the same system conditions.
CHZ
[20]
, t
CLZ
, t
EOLZ
, and t
V
Clock Cycle Time
Maximum Operating Frequency
Clock HIGH
Clock LOW
Data Output Valid After CLK Rise
OE LOW to Output Valid
Data Output Hold After CLK Rise
Clock to High Z
Clock to Low Z
OE HIGH to Output High Z
OE LOW to Output Low Z
Address Setup Before CLK Rise
Data Input Setup Before CLK Rise
CEN Setup Before CLK Rise
WE, BW
ADV/LD Setup Before CLK Rise
Chip Select Setup
Address Hold After CLK Rise
Data Input Hold After CLK Rise
CEN Hold After CLK Rise
WE, BW
ADV/LD Hold after CLK Rise
Chip Select Hold After CLK Rise
CC
EOHZ
(typical) to the First Access Read or Write
are specified with AC test conditions shown in (b) of
x
x
[18, 19]
AC Test Loads and Waveforms on page 20
Setup Before CLK Rise
Hold After CLK Rise
DDQ
[21, 22, 23]
[21, 22, 23]
= 2.5 V.
Description
EOHZ
power
is less than t
is the time power is supplied above V
[21, 22, 23]
[21, 22, 23]
EOLZ
and t
CHZ
is less than t
unless otherwise noted.
AC Test Loads and Waveforms on page
Min
4.0
2.0
2.0
1.3
1.3
1.4
1.4
0.4
0.4
0.4
0.4
0.4
1.4
1.4
1.4
1.4
0.4
DD
CLZ
1
0
250 MHz
minimum initially, before a read or write operation can be initiated.
to eliminate bus contention between SRAMs when sharing the same data
CY7C1472BV25, CY7C1474BV25
Max
250
3.0
3.0
3.0
3.0
Min
5.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
1
0
200 MHz
Max
20. Transition is measured ±200 mV from
200
3.0
3.0
3.0
3.0
CY7C1470BV25
Min
6.0
2.2
2.2
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
0.5
1
0
167 MHz
Max
167
3.4
3.4
3.4
3.4
Page 21 of 28
Unit
MHz
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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