DSPIC33FJ16MC304-E/PT Microchip Technology, DSPIC33FJ16MC304-E/PT Datasheet - Page 312

16-bit DSC, 16KB Flash,Motor,40 MIPS,nanoWatt 44 TQFP 10x10x1mm TRAY

DSPIC33FJ16MC304-E/PT

Manufacturer Part Number
DSPIC33FJ16MC304-E/PT
Description
16-bit DSC, 16KB Flash,Motor,40 MIPS,nanoWatt 44 TQFP 10x10x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ16MC304-E/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 9x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC33FJ16MC304-E/PTTR
DSPIC33FJ16MC304-E/PTTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ16MC304-E/PT
Manufacturer:
Microchip
Quantity:
175
Part Number:
DSPIC33FJ16MC304-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
TABLE A-6:
DS70283H-page 312
Section 24.0 “Electrical Characteristics”
Section 25.0 “High Temperature Electrical
Characteristics”
Section 26.0 “Packaging Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added the 28-pin SSOP Thermal Packaging Characteristics (see
Table
Removed Note 4 from the DC Temperature and Voltage
Specifications (see
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see
Updated Note 3 of the PLL Clock Timing Specifications (see
Table
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see
Updated all SPI specifications (see
and
Added Note 4 to the 12-bit mode ADC Module Specifications (see
Table
Added Note 4 to the 10-bit mode ADC Module Specifications (see
Table
Updated all ambient temperature and range values to +150ºC
throughout the chapter.
Updated the storage temperature and range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table
Added the 28-Lead SSOP package information (see
“Package Marking Information”
Details”).
Added the “SS” definition for the SSOP package.
Figure 24-14
Table
24-3).
24-17).
24-43).
24-44).
25-10).
25-17).
25-18).
24-18).
through
Table
Table
Update Description
24-4).
24-9).
Figure
Table
24-20).
24-21).
and
Table 24-32
© 2011 Microchip Technology Inc.
Section 26.2 “Package
through
Section 26.1
Table 24-39

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