PMEG4005CT,215 NXP Semiconductors, PMEG4005CT,215 Datasheet
PMEG4005CT,215
Specifications of PMEG4005CT,215
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PMEG4005CT,215 Summary of contents
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PMEG4005CT 500 mA low V Rev. 2 — 20 September 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PMEG4005CT 4. Marking Table 4. Type number PMEG4005CT [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device; one diode loaded P tot amb T stg [1] Device mounted on a ceramic PCB °C prior to surge. [ [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0.5 0. 0.25 0.2 0.1 0.05 0.02 0. −3 − FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0.5 0.33 ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0 0.33 0.25 0.2 0.1 0.05 0.01 0. −3 − Ceramic PCB standard footprint 2 3 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. ° Symbol Per diode [1] When switched from I ...
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... NXP Semiconductors (A) 1 (1) (2) −1 10 (3) (4) (5) −2 10 −3 10 −4 10 0.0 0.1 0.2 0.3 0.4 = 150 °C ( 125 °C ( °C ( °C ( −40 °C ( Fig 4. Forward current as a function of forward voltage; typical values = 25 ° MHz; T amb Fig 6. Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors 0.4 P F(AV) (W) 0.3 (2) 0.2 (1) 0.1 0.0 0.0 0.25 = 150 ° (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ Fig 7. Average forward power dissipation as a function of average forward current; typical values 0.75 (1) I F(AV) (A) (2) 0.50 (3) (4) 0.25 0 100 FR4 PCB, standard footprint = 150 ° ...
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... NXP Semiconductors 0.75 (1) I F(AV) (A) (2) 0.50 (3) (4) 0.25 0 100 Ceramic PCB standard footprint 150 ° (1) δ (2) δ kHz (3) δ kHz (4) δ kHz Fig 11. Average forward current as a function of ambient temperature; typical values 8. Test information D.U. Ω × ( Input signal: reverse pulse rise time t Oscilloscope: rise time ...
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... NXP Semiconductors Fig 14. Duty cycle definition The current ratings for the typical waveforms as shown in calculated according to the equations RMS 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors [1] For further information and the availability of packing methods, see 11. Soldering 3 1.7 Fig 16. Reflow soldering footprint SOT23 (TO-236AB) 4.6 2.6 Fig 17. Wave soldering footprint SOT23 (TO-236AB) PMEG4005CT Product data sheet 500 mA low V 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3× ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PMEG4005CT v.2 20100920 • Modifications: Table 2 • Section 13 “Legal PMEG4005CT_1 20090605 PMEG4005CT Product data sheet 500 mA low V Data sheet status Product data sheet “Pinning”: Graphic symbol amended information”: updated Product data sheet All information provided in this document is subject to legal disclaimers ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information ...