BAT54H,115 NXP Semiconductors, BAT54H,115 Datasheet - Page 2

• Manufacturer Part Number: BAT54H,115
• Description: DIODE SCHOTTKY 30V 200MA SOD123
• Manufacturer: NXP Semiconductors

Specifications of BAT54H,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Forward (vf) (max) @ If: 800mV @ 100mA
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 10pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.6 A
• Configuration: Single
• Forward Voltage Drop: 0.8 V @ 0.1 A
• Maximum Reverse Leakage Current: 2 uA @ 25 V
• Operating Temperature Range: + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3415-2; 934059278115; BAT54H T/R

NXP Semiconductors
3. Ordering information
4. Marking
5. Limiting values
6. Thermal characteristics
BAT54H_2
Product data sheet
Table 3.
Table 4.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Table 6.
[1]
[2]
[3]
Type number
BAT54H
Type number
BAT54H
Symbol
V
I
I
I
P
T
T
T
Symbol
R
R
F
FRM
FSM
j
amb
stg
R
tot
th(j-a)
th(j-sp)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Parameter
thermal resistance from junction to
ambient
thermal resistance from junction to
solder point
Ordering information
Marking codes
Limiting values
Thermal characteristics
Parameter
reverse voltage
forward current
repetitive peak forward
current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
Package
Name
-
Rev. 02 — 13 January 2010
Description
plastic surface mounted package; 2 leads
Schottky barrier single diode in SOD123F package
Conditions
t
t
T
p
p
amb
≤ 1 s; δ ≤ 0.5
≤ 10 ms
Conditions
in free air
≤ 25 °C
Marking code
AG
[1][2]
[1]
[3]
Min
-
-
-
-
-
-
−65
−65
Min
-
-
Typ
-
-
© NXP B.V. 2010. All rights reserved.
Max
30
200
300
600
375
125
+125
+150
BAT54H
Max
330
70
Version
SOD123F
Unit
V
mA
mA
mA
mW
°C
°C
°C
Unit
K/W
K/W
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