BAT54H,115 NXP Semiconductors, BAT54H,115 Datasheet - Page 5

• Manufacturer Part Number: BAT54H,115
• Description: DIODE SCHOTTKY 30V 200MA SOD123
• Manufacturer: NXP Semiconductors

Specifications of BAT54H,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Forward (vf) (max) @ If: 800mV @ 100mA
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 10pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.6 A
• Configuration: Single
• Forward Voltage Drop: 0.8 V @ 0.1 A
• Maximum Reverse Leakage Current: 2 uA @ 25 V
• Operating Temperature Range: + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3415-2; 934059278115; BAT54H T/R

NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
BAT54H_2
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
BAT54H
Fig 4.
Fig 5.
For further information and the availability of packing methods, see
2.1
Package outline SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD123F
Packing methods
1.6
SOD123F
(2×)
1.1
Dimensions in mm
Rev. 02 — 13 January 2010
3.6
3.4
Description
4 mm pitch, 8 mm tape and reel
2.7
2.5
4.4
2.9
1.6
4
Schottky barrier single diode in SOD123F package
0.70
0.55
1.7
1.5
1
2
1.1 1.2
0.55
0.35
Section
1.2
1.0
0.25
0.10
[1]
04-11-29
Packing quantity
3000
-115
13.
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
BAT54H
10000
-135
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