PMEG4005ET,215 NXP Semiconductors, PMEG4005ET,215 Datasheet - Page 3

• Manufacturer Part Number: PMEG4005ET,215
• Description: SCHOTTKY RECT 40V 0.5A SOT23
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PMEG4005ET,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 470mV @ 500mA
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io): 500mA (DC)
• Current - Reverse Leakage @ Vr: 100µA @ 40V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 50pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.5 A
• Max Surge Current: 10 A
• Configuration: Single
• Forward Voltage Drop: 0.47 V
• Maximum Reverse Leakage Current: 100 uA
• Maximum Power Dissipation: 420 mW
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4134-2; 934059428215; PMEG4005ET T/R; PMEG4005ET T/R

NXP Semiconductors
4. Marking
5. Limiting values
6. Thermal characteristics
PMEGXX05ET_SER_2
Product data sheet
Table 5.
[1]
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 7.
[1]
[2]
[3]
Type number
PMEG2005ET
PMEG3005ET
PMEG4005ET
Symbol Parameter
V
I
I
I
P
T
T
T
Symbol
R
F
FRM
FSM
j
amb
stg
R
tot
th(j-a)
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses P
power losses P
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
reverse voltage
forward current
repetitive peak forward current t
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
Marking codes
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
PMEG2005ET
PMEG3005ET
PMEG4005ET
0.5 A very low V
R
R
are a significant part of the total power losses. Nomograms for determining the reverse
and I
F(AV)
Rev. 02 — 13 January 2010
rating will be available on request.
F
MEGA Schottky barrier rectifiers in SOT23 package
Conditions
t
wave
T
Conditions
in free air
p
p
amb
≤ 1 ms; δ ≤ 0.5
= 8 ms square
≤ 25 °C
Marking code
P3*
P4*
P5*
PMEGxx05ET series
[1][2]
[1][3]
[1]
[1]
[1]
[2]
-
-
-
-
Min
-
-
-
-
-
−65
−65
Min
-
-
Typ
-
-
© NXP B.V. 2010. All rights reserved.
Max
20
30
40
0.5
3.9
10
280
420
150
+150
+150
Max
440
300
Unit
V
V
V
A
A
A
mW
mW
°C
°C
°C
2
2
.
.
Unit
K/W
K/W
3 of 12