PMEG3010EH,115 NXP Semiconductors, PMEG3010EH,115 Datasheet - Page 8

• Manufacturer Part Number: PMEG3010EH,115
• Description: SCHOTTKY RECT 30V 1A SOD123F
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PMEG3010EH,115

• Package / Case: SOD-123 Flat Leads
• Voltage - Forward (vf) (max) @ If: 560mV @ 1A
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 1A (DC)
• Current - Reverse Leakage @ Vr: 150µA @ 30V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 70pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 1 A
• Max Surge Current: 9 A
• Configuration: Single
• Forward Voltage Drop: 0.56 V
• Maximum Reverse Leakage Current: 150 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4125-2; 934059031115; PMEG3010EH T/R; PMEG3010EH T/R

NXP Semiconductors
PMEG3010EH_EJ_ET_4
Product data sheet
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
4.60
3.00
4.00
0.85
0.85
1.20
1.30
Rev. 04 — 20 March 2007
2
2
3.40
2.80
4.50
2.90
2.50
1.00
3.30
3
3
1.20 (2x)
1 A very low V
0.50 (3x)
1
0.60 (3x)
1
PMEG3010EH/EJ/ET
0.60
(3x)
Dimensions in mm
preferred transport direction during soldering
sot023
2.70
F
MEGA Schottky barrier rectifiers
solder lands
solder resist
occupied area
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2007. All rights reserved.
sot023
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