1PS79SB30,135 NXP Semiconductors, 1PS79SB30,135 Datasheet
1PS79SB30,135
Specifications of 1PS79SB30,135
1PS79SB30 /T3
934056394135
Related parts for 1PS79SB30,135
1PS79SB30,135 Summary of contents
Page 1
DATA SHEET 1PS79SB30 Schottky barrier diode Product data sheet DISCRETE SEMICONDUCTORS M3D319 2001 Feb 20 ...
Page 2
... NXP Semiconductors Schottky barrier diode FEATURES • Very low forward voltage • Very low reverse current • Guard ring protected • Ultra small SMD package. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Blocking diodes • Low power consumption applications (e.g. hand-held applications) ...
Page 3
... NXP Semiconductors Schottky barrier diode ELECTRICAL CHARACTERISTICS = 25 °C unless otherwise specified. T amb SYMBOL PARAMETER V forward voltage F I continuous reverse current R C diode capacitance d Note 1. Pulse test: pulse width = 300 μs; δ = 0.02. THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction to ambient note 1 ...
Page 4
... NXP Semiconductors Schottky barrier diode GRAPHICAL DATA 3 10 handbook, halfpage I F (mA (1) (2) (3) 1 − 0.4 = 125 °C. (1) T amb = 85 °C. (2) T amb = 25 °C. (3) T amb Fig.2 Forward current as a function of forward voltage; typical values. 20 handbook, halfpage C d (pF ° MHz; T amb Fig.4 Diode capacitance as a function of reverse voltage ...
Page 5
... NXP Semiconductors Schottky barrier diode PACKAGE OUTLINE Plastic surface mounted package; 2 leads (1) OUTLINE VERSION IEC SOD523 2001 Feb REFERENCES JEDEC JEITA SC- 0.5 scale DIMENSIONS (mm are the original dimensions) UNIT 0.34 0.17 0.65 1.25 mm 0.26 0.11 0.58 1.15 Note 1. The marking bar indicates the cathode. ...
Page 6
... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...
Page 7
... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...