PMEG2010AET,215 NXP Semiconductors, PMEG2010AET,215 Datasheet
PMEG2010AET,215
Specifications of PMEG2010AET,215
PMEG2010AET T/R
PMEG2010AET T/R
Related parts for PMEG2010AET,215
PMEG2010AET,215 Summary of contents
Page 1
PMEG2010AEH; PMEG2010AET 1 A very low V Rev. 03 — 28 March 2007 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted ...
Page 2
... NXP Semiconductors 2. Pinning information Table 3. Pin SOD123F 1 2 SOT23 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG2010AEH PMEG2010AET 4. Marking Table 5. Type number PMEG2010AEH PMEG2010AET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH ...
Page 3
... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode ...
Page 4
... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol [1] Pulse test: t PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V Characteristics Parameter Conditions forward voltage 100 reverse current diode capacitance MHz R 300 s; 0.02. p Rev. 03 — 28 March 2007 MEGA Schottky barrier rectifiers ...
Page 5
... NXP Semiconductors (mA (1) ( 0.1 0.2 ( 125 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V mdb823 (3) (4) ...
Page 6
... NXP Semiconductors 8. Test information Fig 4. Duty cycle definition 9. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 5. Package outline SOD123F 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number ...
Page 7
... NXP Semiconductors 11. Soldering Fig 7. Reflow soldering footprint SOD123F PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm Rev. 03 — 28 March 2007 MEGA Schottky barrier rectifiers ...
Page 8
... NXP Semiconductors Fig 8. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 9. Wave soldering footprint SOT23 (TO-236AB) PMEG2010AEH_PMEG2010AET_3 Product data sheet PMEG2010AEH; PMEG2010AET 1 A very low V 2.90 2.50 0.85 2 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 4.00 1.20 3 2.80 4.50 Rev. 03 — ...
Page 9
... Release date Data sheet status Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number PMEG2010AET added • ...
Page 10
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 11
... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history ...