STPS1H100A STMicroelectronics, STPS1H100A Datasheet - Page 5

• Manufacturer Part Number: STPS1H100A
• Description: DIODE SCHOTTKY 100V 1A SMA
• Manufacturer: STMicroelectronics

Specifications of STPS1H100A

• Voltage - Forward (vf) (max) @ If: 770mV @ 1A
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 4µA @ 100V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 1 A
• Max Surge Current: 50 A
• Configuration: Single
• Forward Voltage Drop: 0.86 V at 2 A
• Maximum Reverse Leakage Current: 4 uA
• Operating Temperature Range: + 175 C
• Mounting Style: SMD/SMT
• Rectifier Type: Schottky Diode
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 1A
• Rev Curr: 4uA
• Peak Non-repetitive Surge Current (max): 50A
• Forward Voltage: 0.86V
• Operating Temp Range: -65C to 175C
• Package Type: SMA
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-3209-2

STPS1H100
Figure 13. Forward voltage drop versus
Figure 15. Thermal resistance junction to
140
130
120
110
100
100.00
90
80
70
60
50
40
30
20
10.00
1.00
0.10
0.01
0.0
R
0.0
I
th(j-a)
FM
0.5
(A)
(°C/W)
0.2
forward current (maximum values)
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA)
1.0
0.4
1.5
T
j
=125 °C
0.6
2.0
S(Cu)(cm²)
2.5
0.8
3.0
T
j
V
=25 °C
1.0
FM
(V)
3.5
1.2
4.0
1.4
4.5
SMA
1.6
5.0
Figure 14. Thermal resistance junction to
Figure 16. Thermal resistance junction to
200
180
160
140
120
100
120
110
100
90
80
70
60
50
40
30
20
80
60
40
20
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
0.0
R
R
th(j-a)
th(j-a)
0.5
(°C/W)
(°C/W)
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMB)
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMAflat)
1.0
1.5
2.0
S(Cu)(cm²)
S(Cu)(cm²)
2.5
3.0
3.5
Characteristics
4.0
SMAflat
4.5
SMB
5.0
5/10