STPS3150 STMicroelectronics, STPS3150 Datasheet
![DIODE SCHOTTKY 3A 150V DO-201AD](/photos/5/36/53649/497-do-201ab__axial_series_sml.jpg)
STPS3150
Specifications of STPS3150
Available stocks
Related parts for STPS3150
STPS3150 Summary of contents
Page 1
... STPS3150 STPS3150RL STPS3150UF Parameter SMB DO-201AD SMB flat SMB DO-201AD SMB flat (1) Rev 4 STPS3150 Power Schottky rectifier DO-201AD SMB STPS3150 A K SMB flat STPS3150UF Marking G315 STPS3150 STPS3150 FG315 Value 150 = 130° C δ 140° C δ 150° C δ = 0.5 ...
Page 2
... Average forward current versus ambient temperature (δ = 0.5) (DO-201AD / SMB) ( th(j-a) th(j-I) SMB R =75°C/W th(j- (°C) amb tp =tp 100 125 STPS3150 Unit ° C/W Unit µ DO-201AD 150 175 ...
Page 3
... STPS3150 Figure 3. Average forward current versus ambient temperature (δ = 0.5) (SMB flat) I (A) F(AV) 3 th(j-a) th(j-l) 3.0 2.5 2.0 SMB flat 1.5 1.0 T 0.5 T (°C) δ amb tp =tp/T 0 100 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (DO-201AD) ...
Page 4
... Figure 14. Forward voltage drop versus I (A) FM 100 F=1MHz V =30mV OSC RMS T =25° 100 1000 0.0 0.2 STPS3150 impedance junction to ambient versus pulse duration (DO-2001AD) th(j-a) δ t (s) =tp/T p 1.E+00 1.E+01 1.E+02 reverse voltage applied (typical values) T =150° =125° =100° =75° ...
Page 5
... STPS3150 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4 (°C/W) th(j-a) 110 100 (cm² 0.0 0.5 1.0 1.5 2.0 2.5 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, e ...
Page 6
... Epoxy meets UL94, V0. Table 4. SMB dimensions Figure 18. SMB footprint (dimensions in mm) 6/10 Ref 1.62 2.60 1.62 5.84 STPS3150 Dimensions Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.40 0.006 0.016 5.10 5.60 ...
Page 7
... STPS3150 Table 5. SMB Flat dimensions Applies to plated leads Figure 19. SMB Flat footprint (dimensions in mm) Ref ( ( 5.84 1.20 3.44 1.20 Package information Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.90 1.10 0.035 1.95 2.20 0.077 0.15 0.40 0.006 3.30 3.95 0.130 5 ...
Page 8
... JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK trademark. ECOPACK specifications are available at: www.st.com. 8/ Note 1 Note 2 ØC STPS3150 DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A 9.50 0.374 B 25 ...
Page 9
... STPS3150RL 4 Revision history Date May-2003 31-May-2006 08-Feb-2007 Marking Package G315 SMB FG315 SMB flat STPS3150 DO-201AD STPS3150 DO-201AD Revision 2A Last update. Reformatted to current standard. Added ECOPACK statement. 3 Updated SMB footprint in Figure 12. Changed Figure 8. 4 Added SMB flat package. Ordering information Weight ...
Page 10
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com STPS3150 ...