UPA2791GR-E2-AT Renesas Electronics America, UPA2791GR-E2-AT Datasheet - Page 13

• Manufacturer Part Number: UPA2791GR-E2-AT
• Description: MOSFET N/P-CH 30V 8-SOIC
• Manufacturer: Renesas Electronics America

Specifications of UPA2791GR-E2-AT

• Fet Type: N and P-Channel
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 36 mOhm @ 3A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 5A
• Vgs(th) (max) @ Id: 2.5V @ 1mA
• Gate Charge (qg) @ Vgs: 10nC @ 10V
• Input Capacitance (ciss) @ Vds: 400pF @ 10V
• Power - Max: 2W
• Mounting Type: Surface Mount
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TAPE INFORMATION
MARKING INFORMATION
RECOMMENDED SOLDERING CONDITIONS
sales representative.
Caution Do not use different soldering methods together (except for partial heating).
The
Infrared reflow
Partial heating
There are two types (-E1, -E2) of taping depending on the direction of the device.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
μ
PA2791GR should be soldered and mounted under the following recommended conditions.
Maximum temperature (Package's surface temperature): 260°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220°C: 60 seconds or less
Preheating time at 160 to 180°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Reel side
1 pin mark
−E1 TYPE
Data Sheet G18207EJ2V0DS
A2791
Pb-free plating marking
Soldering Conditions
−E2 TYPE
Lot code
Draw-out side
μ
Condition Symbol
Recommended
PA2791GR
IR60-00-3
P350
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