TDA8559TD NXP Semiconductors, TDA8559TD Datasheet - Page 36

• Manufacturer Part Number: TDA8559TD
• Description: Audio Amplifiers HEADPHONE AMP LV
• Manufacturer: NXP Semiconductors

Specifications of TDA8559TD

• Product: Class-AB
• Output Power: 140 mW
• Available Set Gain: 32 dB
• Thd Plus Noise: 0.05 %
• Operating Supply Voltage: 3 V
• Supply Current: 2.75 mA
• Maximum Power Dissipation: 1190 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Bias Current (max): 300 nA
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 30 V
• Supply Voltage (min): 1.9 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOIC-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA8559T/N1,512

Philips Semiconductors
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
11
12
13
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10
13.11
13.12
13.13
13.14
13.15
13.16
14
14.1
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal characteristics. . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 29
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 30
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
V/I converters . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Output amplifiers. . . . . . . . . . . . . . . . . . . . . . . . 5
Buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Dynamic quiescent controller . . . . . . . . . . . . . . 6
Stabilizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Input logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Heatsink design . . . . . . . . . . . . . . . . . . . . . . . 12
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 12
Input configurations . . . . . . . . . . . . . . . . . . . . 13
Standby/mute . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application 1: SE with loudspeaker capacitor. 14
Application 2: SE to buffer (without
loudspeaker capacitor) . . . . . . . . . . . . . . . . . 14
Application 3: Improved SE to buffer (without
loudspeaker capacitor) . . . . . . . . . . . . . . . . . . 14
Application 4: Bridge tied load mono amplifier 14
Application 5: Line driver application . . . . . . . 14
Application 6: Line driver application . . . . . . . 14
Application 7: Line driver application . . . . . . . 15
Application diagrams . . . . . . . . . . . . . . . . . . . 15
Printed-circuit board layout . . . . . . . . . . . . . . . 22
Response curves for low input mode . . . . . . . 22
Response curves for high input mode . . . . . . 26
Quality information . . . . . . . . . . . . . . . . . . . . . 29
16.1
16.2
16.3
16.4
16.5
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [e-mail].
Revision history . . . . . . . . . . . . . . . . . . . . . . . 34
Legal information . . . . . . . . . . . . . . . . . . . . . . 35
Contact information . . . . . . . . . . . . . . . . . . . . 35
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 31
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 31
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 32
Package related soldering information . . . . . . 32
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 35
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Low-voltage stereo headphone amplifier
TDA8559T
Document identifier: TDA8559_3
Date of release: 15 May 2006
All rights reserved.