TDA8932BTW NXP Semiconductors, TDA8932BTW Datasheet - Page 45
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TDA8932BTW
Manufacturer Part Number
TDA8932BTW
Description
Audio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8932BTW.pdf
(48 pages)
Specifications of TDA8932BTW
Product
Class-D
Output Power
55 W
Available Set Gain
36 dB
Common Mode Rejection Ratio (min)
75 dB
Thd Plus Noise
0.007 %
Operating Supply Voltage
22 V
Supply Current
0.6 mA
Maximum Power Dissipation
5000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
8 Ohms
Dual Supply Voltage
+/- 11 V
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential, Single
Supply Type
Single or Dual
Supply Voltage (max)
36 V
Supply Voltage (min)
10 V
Output Type
1-Channel Mono or 2-Channel Stereo
Package / Case
HTSSOP-32
Operational Class
Class-D
Audio Amplifier Output Configuration
1-Channel Mono/2-Channel Stereo
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.007@8Ohm@1W%
Single Supply Voltage (typ)
22V
Dual Supply Voltage (typ)
±11V
Supply Current (max)
0.195@22VmA
Power Supply Requirement
Single/Dual
Power Dissipation
5W
Rail/rail I/o Type
No
Single Supply Voltage (min)
10V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±5V
Dual Supply Voltage (max)
±18V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Package Type
HTSSOP EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TDA8932BTW/N2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8932BTW
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Company:
Part Number:
TDA8932BTW/N2
Manufacturer:
NXP
Quantity:
200
Part Number:
TDA8932BTW/N2
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
TDA8932BTW/N2118
Manufacturer:
NXP Semiconductors
Quantity:
1 876
NXP Semiconductors
17. Abbreviations
TDA8932B_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 18.
Acronym
BTL
DMOS
ESD
OCP
OTP
OVP
PWM
SE
TF
UBP
UVP
WP
Fig 42. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Bridge Tied Load
Double diffused Metal Oxide Semiconductor
ElectroStatic Discharge
OverCurrent Protection
OverTemperature Protection
OverVoltage Protection
Pulse Width Modulation
Single-Ended
Thermal Foldback
UnBalance Protection
UnderVoltage Protection
Window Protection
Rev. 04 — 18 December 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
Class-D audio amplifier
peak
TDA8932B
© NXP B.V. 2008. All rights reserved.
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