TJA1040TD NXP Semiconductors, TJA1040TD Datasheet - Page 11

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TJA1040TD

Manufacturer Part Number
TJA1040TD
Description
Network Controller & Processor ICs HI SPD CAN TRANSCVR
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TJA1040TD

Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
1 MBd
Supply Voltage (max)
5.25 V
Supply Voltage (min)
4.75 V
Supply Current (max)
70 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
SOIC-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TJA1040T/N1,112
Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 14
TXD
GND
V
RXD
SPLIT
CANL
CANH
STB
CC
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
PAD
1
2
3
4
5
6
7
8
1214.25
1635.25
1516.5
530.25
113.75
119.5
648.5
990.5
COORDINATES
x
1273.75
1273.75
114.5
114.5
114.5
1275
1246
(1)
85
y
11
handbook, halfpage
The backside of the bare die must be connected to ground.
x
0
0
y
Fig.9 Bonding pad locations.
8
1
TJA1040U
7
2
6
3
Product specification
5
4
TJA1040
test pad 1
test pad 2
MBL584

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