BSN20,215 NXP Semiconductors, BSN20,215 Datasheet - Page 4

MOSFET N-CH 50V 173MA SOT-23

BSN20,215

Manufacturer Part Number
BSN20,215
Description
MOSFET N-CH 50V 173MA SOT-23
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Type
Power MOSFETr
Datasheet

Specifications of BSN20,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
15 Ohm @ 100mA, 10V
Drain To Source Voltage (vdss)
50V
Current - Continuous Drain (id) @ 25° C
173mA
Vgs(th) (max) @ Id
1V @ 1mA
Input Capacitance (ciss) @ Vds
25pF @ 10V
Power - Max
830mW
Mounting Type
Surface Mount
Minimum Operating Temperature
- 65 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
15 Ohm @ 10 V
Drain-source Breakdown Voltage
50 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.173 A
Power Dissipation
830 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
15Ohm
Drain-source On-volt
50V
Gate-source Voltage (max)
±20V
Drain Current (max)
173mA
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-65C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
TO-236AB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Compliant
Other names
568-1658-2
934012500215
BSN20 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSN20,215
Manufacturer:
ST
0
Part Number:
BSN20,215
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
7. Thermal characteristics
Table 4:
Philips Semiconductors
9397 750 07213
Product specification
Symbol
R
R
th(j-sp)
th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to solder
point
thermal resistance from junction to ambient
7.1 Transient thermal impedance
Fig 4. Transient thermal impedance from junction to solder point as a function of
Mounted on a metal clad substrate.
Z th(j-sp)
(K/W)
pulse duration.
Rev. 03 — 26 June 2000
Conditions
mounted on a metal clad substrate;
Figure 4
mounted on a printed circuit board;
minimum footprint
N-channel enhancement mode field-effect transistor
© Philips Electronics N.V. 2000. All rights reserved.
P
t p
Value
150
350
T
=
BSN20
t p
T
t
03aa47
Unit
K/W
K/W
4 of 13

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