STP22NS25Z STMicroelectronics, STP22NS25Z Datasheet - Page 3

MOSFET N-CH 250V 22A TO-220

STP22NS25Z

Manufacturer Part Number
STP22NS25Z
Description
MOSFET N-CH 250V 22A TO-220
Manufacturer
STMicroelectronics
Series
MESH OVERLAY™r
Datasheet

Specifications of STP22NS25Z

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
150 mOhm @ 11A, 10V
Drain To Source Voltage (vdss)
250V
Current - Continuous Drain (id) @ 25° C
22A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
151nC @ 10V
Input Capacitance (ciss) @ Vds
2400pF @ 25V
Power - Max
135W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.15 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
22 S
Drain-source Breakdown Voltage
250 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
22 A
Power Dissipation
135000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Continuous Drain Current Id
11A
Drain Source Voltage Vds
250V
On Resistance Rds(on)
130mohm
Rds(on) Test Voltage Vgs
20V
Threshold Voltage Vgs Typ
3V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-6740-5
STP22NS25Z

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Part Number
Manufacturer
Quantity
Price
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STP22NS25Z
Manufacturer:
ST
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FUJI
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STP22NS25Z
Quantity:
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STB22NS25Z - STP22NS25Z
1
Electrical ratings
Table 1.
1. Pulse width limited by safe operating area
2. I
Table 2.
Table 3.
V
Rthj-case Thermal resistance junction-case Max
Rthj-amb Thermal resistance junction-ambient Max
Symbol
Symbol
dv/dt
ESD(G-S)
I
V
P
DM
V
V
E
T
SD
I
DGR
I
I
TOT
T
T
AR
DS
GS
stg
AS
D
D
j
l
(1)
< 22A, di/dt < 200A/µs, V
(2)
Avalanche current, repetitive or not-repetitive
(pulse width limited by T
Single pulse avalanche energy
(starting T
Drain-source voltage (V
Drain-gate voltage (R
Gate- source voltage
Drain current (continuos) at T
Drain current (continuos) at T
Drain current (pulsed)
Total dissipation at T
Derating factor
Gate source ESD(HBM-C=100pF, R=1.5KΩ)
Peak diode recovery voltage slope
Storage temperature
Max. operating junction temperature
Maximum lead temperature for soldering purpose
Absolute maximum ratings
Thermal data
Avalanche Characteristics
j
= 25°C, I
DD
Parameter
Parameter
= 80% V
D
C
GS
= I
= 25°C
GS
j
AR
= 20 kΩ)
max)
= 0)
, V
(BR)DSS
C
C
DD
= 25°C
= 100°C
= 50V, R
g
= 47Ω)
–55 to 150
Max value
Value
2500
0.93
62.5
± 20
13.9
1.07
300
250
250
135
22
88
5
350
22
Electrical ratings
°C/W
°C/W
W/°C
V/ns
Unit
°C
Unit
°C
W
mJ
V
V
V
A
A
A
V
3/14
A

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