IRF7233TRPBF International Rectifier, IRF7233TRPBF Datasheet - Page 2

MOSFET P-CH 12V 9.5A 8-SOIC

IRF7233TRPBF

Manufacturer Part Number
IRF7233TRPBF
Description
MOSFET P-CH 12V 9.5A 8-SOIC
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF7233TRPBF

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
20 mOhm @ 9.5A, 4.5V
Drain To Source Voltage (vdss)
12V
Current - Continuous Drain (id) @ 25° C
9.5A
Vgs(th) (max) @ Id
600mV @ 250µA
Gate Charge (qg) @ Vgs
74nC @ 5V
Input Capacitance (ciss) @ Vds
6000pF @ 10V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
20 mOhms
Drain-source Breakdown Voltage
- 12 V
Gate-source Breakdown Voltage
12 V
Continuous Drain Current
- 9.5 A
Power Dissipation
2.5 W
Mounting Style
SMD/SMT
Gate Charge Qg
49 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRF7233PBFTR
IRF7233TRPBF
IRF7233TRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF7233TRPBF
Manufacturer:
IR
Quantity:
20 000
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Electrical Characteristics @ T
IRF7233PbF
Source-Drain Ratings and Characteristics
Notes:
R
V
V
∆V
V
g
Q
Q
Q
t
t
t
t
C
C
C
I
I
V
t
Q
I
SM
DSS
d(on)
r
d(off)
f
S
rr
GSS
DS(on)
fs
(BR)DSS
(BR)DSS
GS(th)
2
iss
oss
rss
SD
g
gs
gd
rr
Repetitive rating; pulse width limited by
Pulse width ≤ 300µs; duty cycle ≤
(BR)DSS
max. junction temperature.
/∆T
J
Static Drain-to-Source On-Resistance
Drain-to-Source Breakdown Voltage
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Drain-to-Source Leakage Current
Parameter
Parameter
J
= 25°C (unless otherwise specified)
ƒ
When mounted on 1 inch square copper board, t<10 sec
R
Starting T
Min. Typ. Max. Units
Min. Typ. Max. Units
––– 0.013 0.020
-0.6
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– 2400 –––
––– 2220 –––
––– 0.001 –––
–––
––– 4530 6000
–––
–––
–––
-14
-12
3.3
G
= 25Ω, I
0.023 0.033
–––
–––
–––
–––
–––
––– -100
–––
540
–––
––– -100
370
–––
9.3
49
22
26
77
43
35
J
= 25°C, L = 1.3mH
AS
–––
–––
–––
–––
-1.0
100
–––
–––
–––
–––
-1.2
-10
= 9.5A.
-76
74
14
32
-2.5
65
52
V/°C
µA
nC
nA
pF
nC
ns
ns
V
V
V
S
V
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
ƒ = 1.0kHz
MOSFET symbol
integral reverse
p-n junction diode.
T
di/dt = 100A/µs
showing the
T
D
D
J
J
GS
GS
GS
GS
DS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
DS
D
G
= -9.5A
= -9.5A
= 25°C, I
= 25°C, I
= 1.0Ω
= 6.2Ω ‚
= 0V
= 0V, I
= 0V, I
= -4.5V, I
= -2.5V, I
= V
= -10V, I
= -12V, V
= -9.6V, V
= -12V, V
= -12V
= 12V
= -10V
= -5.0V‚
= -10V
= -10V
GS
Conditions
, I
D
D
S
F
D
Conditions
D
= -5.0mA
= -250µA
= -2.5A
= -2.5A, V
D
D
GS
GS
= -250µA
GS
= -9.5A
= -9.5A ‚
= -6.0A ‚
= 0V
= 0V, T
= 0V
D
www.irf.com
= -1mA
GS
J
= 70°C
G
= 0V ‚
D
S

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