BUK9518-55,127 NXP Semiconductors, BUK9518-55,127 Datasheet - Page 2
![MOSFET N-CH 55V 57A SOT78](/photos/5/30/53046/568-to-220ab-3_sot78_sml.jpg)
BUK9518-55,127
Manufacturer Part Number
BUK9518-55,127
Description
MOSFET N-CH 55V 57A SOT78
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet
1.BUK9518-55127.pdf
(8 pages)
Specifications of BUK9518-55,127
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
18 mOhm @ 25A, 5V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
57A
Vgs(th) (max) @ Id
2V @ 1mA
Input Capacitance (ciss) @ Vds
2600pF @ 25V
Power - Max
125W
Mounting Type
Through Hole
Package / Case
TO-220AB-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Other names
934045210127
BUK9518-55
BUK9518-55
BUK9518-55
BUK9518-55
Philips Semiconductors
STATIC CHARACTERISTICS
T
DYNAMIC CHARACTERISTICS
T
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
April 1998
TrenchMOS
Logic level FET
j
SYMBOL PARAMETER
V
V
I
I
R
mb
SYMBOL PARAMETER
g
C
C
C
t
t
t
t
L
L
L
j
SYMBOL PARAMETER
I
I
V
t
Q
= 25˚C unless otherwise specified
DSS
GSS
d on
r
d off
f
DR
DRM
rr
= 25˚C unless otherwise specified
V
fs
d
d
s
(BR)DSS
GS(TO)
SD
DS(ON)
iss
oss
rss
rr
= 25˚C unless otherwise specified
(BR)GSS
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Gate source leakage current
Gate-source breakdown
voltage
Drain-source on-state
resistance
Forward transconductance
Input capacitance
Output capacitance
Feedback capacitance
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Internal drain inductance
Internal drain inductance
Internal source inductance
Continuous reverse drain
current
Pulsed reverse drain current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
transistor
CONDITIONS
V
V
V
V
I
V
CONDITIONS
V
V
V
V
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
CONDITIONS
I
I
I
V
G
F
F
F
GS
DS
DS
GS
GS
DS
GS
DD
GS
GS
= 25 A; V
= 50 A; V
= 50 A; -dI
= 1 mA;
= 0 V; I
= V
= 55 V; V
= 5 V; V
= 5 V; I
= 25 V; I
= 0 V; V
= 30 V; I
= 5 V; R
= -10 V; V
GS
; I
2
D
D
D
GS
GS
DS
G
D
D
F
= 0.25 mA;
= 1 mA
= 25 A
GS
DS
/dt = 100 A/ s;
= 10
= 25 A
= 25 A;
= 0 V
= 0 V
R
= 25 V; f = 1 MHz
= 30 V
= 0 V;
= 0 V
T
T
T
T
T
T
j
j
j
j
j
j
= 175˚C
= 175˚C
= 175˚C
= 175˚C
= -55˚C
= -55˚C
MIN.
MIN.
MIN.
1.0
0.5
55
50
10
25
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
TYP.
2000
TYP.
0.05
0.02
0.95
390
200
100
1.5
3.5
4.5
7.5
1.0
0.1
15
52
30
80
50
48
-
-
-
-
-
-
-
-
-
-
Product specification
BUK9518-55
MAX.
MAX.
MAX.
2600
500
490
290
130
140
200
2.0
2.3
1.2
10
10
18
38
45
75
57
1
-
-
-
-
-
-
-
-
-
-
-
Rev 1.000
UNIT
UNIT
UNIT
m
m
uA
nH
nH
nH
pF
pF
pF
ns
ns
ns
ns
ns
V
V
V
V
V
V
S
A
A
V
V
C
A
A
A