CBT3384DK-T NXP Semiconductors, CBT3384DK-T Datasheet
CBT3384DK-T
Specifications of CBT3384DK-T
Related parts for CBT3384DK-T
CBT3384DK-T Summary of contents
Page 1
... Ordering information Table 1. Ordering information Type Package number Temperature range Name CBT3384D +85 C CBT3384DB +85 C CBT3384DK +85 C CBT3384PW +85 C [1] Also known as QSOP24 package switch connection between two ports Description SO24 plastic small outline package; 24 leads; body width 7.5 mm SSOP24 plastic shrink small outline package; 24 leads; ...
Page 2
... NXP Semiconductors 4. Functional diagram Fig 1. Logic diagram 5. Pinning information 5.1 Pinning CBT3384 1OE 1 2 1B1 1A1 3 1A2 4 5 1B2 1B3 6 1A3 7 1A4 8 9 1B4 1B5 10 1A5 11 12 GND 001aak878 Fig 2. Pin configuration for SO24 (SOT137-1) CBT3384_6 Product data sheet 10-bit bus switch with 5-bit output enables ...
Page 3
... NXP Semiconductors Fig 4. Pin configuration for SSOP24 (SOT556-1) 5.2 Pin description Table 2. Pin description Symbol Pin 1OE, 2OE 1, 13 1A1 to 1A5 2A1 to 2A5 14, 17, 18, 21, 22 1B1 to 1B5 2B1 to 2B5 15, 16, 19, 20, 23 GND Functional description [1] Table 3. Function selection Input 1OE 2OE ...
Page 4
... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134 +85 C, unless otherwise specified. amb Symbol Parameter V supply voltage CC V input voltage I I output current O I input clamping current IK T storage temperature stg [1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under conditions for extended periods may affect device reliability ...
Page 5
... NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter R ON resistance ON [1] All typical values are [2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than V [3] Measured by the voltage drop between the nAn and the nBn terminals at the indicated current through the switch. ON resistance is determined by the lowest voltage of the two (nAn or nBn) terminals ...
Page 6
... NXP Semiconductors 11. Waveforms Measurement points are given in Logic levels: V and Fig 5. The data input (nAn, nBn) to output (nBn, nAn) propagation delay times nOE input output LOW to OFF OFF to LOW output HIGH to OFF OFF to HIGH Measurement points are given in Logic levels: V and V ...
Page 7
... NXP Semiconductors 12. Test information Test data is given in Table All input pulses are supplied by generators having the following characteristics: PRR The outputs are measured one at a time with one transition per measurement. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance. ...
Page 8
... NXP Semiconductors 13. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
Page 9
... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 9. Package outline SOT340-1 (SSOP24) ...
Page 10
... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 0.0098 0.061 inches 0.068 0.01 0.0040 0.055 Note 1 ...
Page 11
... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
Page 12
... Release date CBT3384_6 20091102 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Changed: a. Pass voltage values have changed. ...
Page 13
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 14
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...