MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 15

DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R

MT47H32M16HR-3 IT:F TR

Manufacturer Part Number
MT47H32M16HR-3 IT:F TR
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr

Specifications of MT47H32M16HR-3 IT:F TR

Density
512 Mb
Maximum Clock Rate
667 MHz
Package
84FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Figure 7: 84-Ball FBGA – x16 Ball Assignments (Top View)
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
M
A
D
G
H
K
N
B
C
R
E
F
L
P
J
DQ14
DQ12
V
V
V
DQ6
DQ4
V
V
RFU
V
V
DDQ
DDQ
DDL
1
DD
DD
DD
SS
V
V
V
V
DQ9
DQ1
V
CKE
BA0
A10
A12
NC
NC
A3
A7
2
SSQ
SSQ
SSQ
SSQ
REF
DQ11
V
V
UDM
LDM
DQ3
WE#
BA1
RFU
V
V
V
A1
A5
A9
DDQ
DDQ
3
SS
SS
SS
4
15
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball Assignments and Descriptions
6
512Mb: x4, x8, x16 DDR2 SDRAM
UDQS
DQ10
V
LDQS
V
V
RAS#
CAS#
V
V
DQ2
A11
RFU
A2
A6
DDQ
DDQ
SSDL
SSQ
SSQ
7
UDQS#/NU
LDQS#/NU
V
V
V
V
DQ8
DQ0
CK#
RFU
CS#
CK
A0
A4
A8
SSQ
SSQ
SSQ
SSQ
8
DQ15
DQ13
V
V
V
V
DQ7
DQ5
ODT
V
V
© 2004 Micron Technology, Inc. All rights reserved.
V
DDQ
DDQ
DDQ
DDQ
9
DD
DD
SS

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