MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 19

• Manufacturer Part Number: MT47H32M16HR-3 IT:F TR
• Description: DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-3 IT:F TR

• Density: 512 Mb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
60X Ø0.45
Seating
0.12 A
Plane
8 CTR
0.8 TYP
Notes:
A
Nonconductive overmold
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
6.4 CTR
1.8 CTR
8 ±0.1
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
19
0.8 ±0.05
10 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging