MT48H16M16LFBF-75:H TR Micron Technology Inc, MT48H16M16LFBF-75:H TR Datasheet - Page 14

• Manufacturer Part Number: MT48H16M16LFBF-75:H TR
• Description: DRAM Chip Mobile SDRAM 256M-Bit 16Mx16 1.8V 54-Pin VFBGA T/R
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M16LFBF-75:H TR

• Package: 54VFBGA
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: 0 to 70 °C

Figure 6: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Solder ball
material: SAC105.
Dimensions apply to
solder balls post-
reflow on Ø0.4
SMD ball pads.
90X Ø0.45
Seating
11.2 CTR
plane
0.1 A
0.8 TYP
Note:
A
9
8
1. All dimensions are in millimeters.
7
0.8 TYP
6.4 CTR
8 ±0.1
Ball A1 ID
3
2
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
14
13 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID