MT48LC16M16A2FG-75:D Micron Technology Inc, MT48LC16M16A2FG-75:D Datasheet - Page 80

DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin VFBGA Tray

MT48LC16M16A2FG-75:D

Manufacturer Part Number
MT48LC16M16A2FG-75:D
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M16A2FG-75:D

Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54VFBGA
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M16A2FG-75:D TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC16M16A2FG-75:D TR
Manufacturer:
MICRON
Quantity:
80
AUTO REFRESH Operation
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
The AUTO REFRESH command is used during normal operation of the device to refresh
the contents of the array. This command is nonpersistent, so it must be issued each
time a refresh is required. All active banks must be precharged prior to issuing an AUTO
REFRESH command. The AUTO REFRESH command should not be issued until the min-
imum
internal refresh controller. This makes the address bits “Don’t Care” during an AUTO
REFRESH command.
After the AUTO REFRESH command is initiated, it must not be interrupted by any exe-
cutable command until
NOP commands must be issued on each positive edge of the clock. The SDRAM re-
quires that every row be refreshed each
REFRESH command—calculated by dividing the refresh period (
rows to be refreshed—meets the timing requirement and ensures that each row is re-
freshed. Alternatively, to satisfy the refresh requirement a burst refresh can be em-
ployed after every
the number of rows to be refreshed at the minimum cycle rate (
t
RP is met following the PRECHARGE command. Addressing is generated by the
t
REF period by issuing consecutive AUTO REFRESH commands for
t
RFC has been met. During
80
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
REF period. Providing a distributed AUTO
256Mb: x4, x8, x16 SDRAM
t
RFC time, COMMAND INHIBIT or
AUTO REFRESH Operation
© 1999 Micron Technology, Inc. All rights reserved.
t
RFC).
t
REF) by the number of

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