XC3S700AN-4FG484I Xilinx Inc, XC3S700AN-4FG484I Datasheet - Page 12

• Manufacturer Part Number: XC3S700AN-4FG484I
• Description: FPGA Spartan®-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 484-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S700AN-4FG484I

• Package: 484FBGA
• Family Name: Spartan®-3AN
• Device Logic Units: 13248
• Device System Gates: 700000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 372
• Ram Bits: 368640
• Number Of Logic Elements/cells: 13248
• Number Of Labs/clbs: 1472
• Total Ram Bits: 368640
• Number Of I /o: 372
• Number Of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 484-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

DS557 (v4.1) April 1, 2011
DC Electrical Characteristics
In this section, specifications can be designated as
Advance, Preliminary, or Production. These terms are
defined as follows:
Advance: Initial estimates are based on simulation, early
characterization, and/or extrapolation from the
characteristics of other families. Values are subject to
change. Use as estimates, not for production.
Preliminary: Based on characterization. Further changes
are not expected.
Production: These specifications are approved once the
silicon has been characterized over numerous production
lots. Parameter values are considered stable with no future
changes expected.
Table 6: Absolute Maximum Ratings
© Copyright 2007–2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS557 (v4.1) April 1, 2011
Product Specification
Notes:
1.
1.
Symbol
V
V
V
V
V
T
CCAUX
CCINT
V
CCO
I
T
STG
Upper clamp applies only when using PCI IOSTANDARDs.
For soldering guidelines, see UG112: Device Package User Guide and XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free
Packages.
REF
ESD
IK
IN
J
Internal supply voltage
Auxiliary supply voltage
Output driver supply voltage
Input reference voltage
Voltage applied to all User I/O pins and
dual-purpose pins
Voltage applied to all Dedicated pins
Input clamp current per I/O pin
Electrostatic Discharge Voltage
Junction temperature
Storage temperature
Description
70
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Driver in a high-impedance state
–0.5V < V
Human body model
Charged device model
Machine model
DC and Switching Characteristics
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all Spartan®-3AN devices. AC and DC characteristics
are specified using the same numbers for both
commercial and industrial grades.
Absolute Maximum Ratings
Stresses beyond those listed under
Maximum Ratings
device. These are stress ratings only; functional operation
of the device at these or any other conditions beyond those
listed under the Recommended Operating Conditions is not
implied. Exposure to absolute maximum conditions for
extended periods of time adversely affects device reliability.
IN
Conditions
< (V
CCO
Spartan-3AN FPGA Family:
+ 0.5V)
might cause permanent damage to the
(1)
–0.95
–0.5
–0.5
–0.5
–0.5
–0.5
Min
–65
–
–
–
–
–
Product Specification
Table
V
CCO
±2000
±100
±500
±200
Max
1.32
3.75
3.75
125
150
4.6
4.6
6:
+ 0.5
Absolute
Units
mA
°C
°C
V
V
V
V
V
V
V
V
V
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