PUMB16,115 NXP Semiconductors, PUMB16,115 Datasheet
PUMB16,115
Specifications of PUMB16,115
PUMB16 T/R
PUMB16 T/R
Related parts for PUMB16,115
PUMB16,115 Summary of contents
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PEMB16; PUMB16 PNP/PNP resistor-equipped transistors Rev. 03 — 31 August 2009 1. Product profile 1.1 General description PNP/PNP resistor-equipped transistors Table 1. Type number PEMB16 PUMB16 1.2 Features I Built-in bias ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMB16 PUMB16 4. Marking Table 5. Type number PEMB16 PUMB16 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMB16_PUMB16_3 Product data sheet PNP/PNP resistor-equipped transistors Pinning Description GND (emitter) TR1 ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 7. Characteristics Table 8. Characteristics unless otherwise specified. amb Symbol Parameter Per transistor I collector-base cut-off CBO current I collector-emitter CEO cut-off current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage V off-state input voltage V I(off) V on-state input voltage V ...
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... NXP Semiconductors ( 100 C amb ( amb ( amb Fig 1. DC current gain as a function of collector current; typical values I(on) (mV) ( amb ( amb ( 100 C amb Fig 3. On-state input voltage as a function of collector current; typical values PEMB16_PUMB16_3 Product data sheet PNP/PNP resistor-equipped transistors 006aaa198 10 (1) ...
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... NXP Semiconductors 8. Package outline 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 5. Package outline SOT363 (SC-88) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package ...
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... Revision history Document ID Release date PEMB16_PUMB16_3 20090831 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 5 “Package outline SOT363 PEMB16_PUMB16_2 20050610 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Legal information ...