PBLS2001S,115 NXP Semiconductors, PBLS2001S,115 Datasheet
PBLS2001S,115
Specifications of PBLS2001S,115
PBLS2001S T/R
PBLS2001S T/R
Related parts for PBLS2001S,115
PBLS2001S,115 Summary of contents
Page 1
PBLS2001S 20 V PNP BISS loadswitch Rev. 02 — 24 August 2009 1. Product profile 1.1 General description PNP low V Equipped Transistor (RET SOT96-1 (SO8) small Surface-Mounted Device (SMD) plastic package. 1.2 Features I Low V I ...
Page 2
... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PBLS2001S 4. Marking Table 4. Type number PBLS2001S PBLS2001S_2 Product data sheet Pinning Description input (base) TR2 GND (emitter) TR2 base TR1 emitter TR1 collector TR1 collector TR1 output (collector) TR2 ...
Page 3
... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol TR1; PNP low V V CBO V CEO V EBO tot TR2; NPN resistor-equipped transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
Page 4
... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for collector 1cm (3) FR4 PCB, standard footprint Fig 1. 6. Thermal characteristics Table 6. Symbol Per device R th(j-a) TR1; PNP low V R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
Page 5
... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/W) 1.0 0. 0.5 0.33 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 2. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 ...
Page 6
... NXP Semiconductors th(j-a) (K/W) duty cycle = 2 10 1.0 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 0. Ceramic PCB standard footprint 2 3 Fig 4. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table unless otherwise specified ...
Page 7
... NXP Semiconductors Table unless otherwise specified amb Symbol Parameter V BEsat V BEon off TR2; NPN resistor-equipped transistor I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBLS2001S_2 Product data sheet Characteristics …continued Conditions base-emitter saturation voltage base-emitter turn- voltage delay time ...
Page 8
... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 5. TR1 (PNP): DC current gain as a function of collector current; typical values 1 (V) 0.9 (1) 0.7 (2) 0.5 (3) 0 amb ( amb ( 100 C amb Fig 7. TR1 (PNP): Base-emitter voltage as a function of collector current; typical values ...
Page 9
... NXP Semiconductors 1 V CEsat (V) ( 100 C amb ( amb ( amb Fig 9. TR1 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values 10 R CEsat ( ) ( 100 C amb ( amb ( amb Fig 11. TR1 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values PBLS2001S_2 Product data sheet ...
Page 10
... NXP Semiconductors ( 150 C amb ( amb ( amb Fig 13. TR2 (NPN): DC current gain as a function of collector current; typical values I(on) (V) 10 (1) ( amb ( amb ( 100 C amb Fig 15. TR2 (NPN): On-state input voltage as a function of collector current; typical values PBLS2001S_2 Product data sheet ...
Page 11
... NXP Semiconductors 8. Test information Fig 17. BISS transistor switching time definition Fig 18. Test circuit for switching times PBLS2001S_2 Product data sheet (probe) oscilloscope 450 100 mA 100 mA open Bon Boff Rev. 02 — 24 August 2009 PBLS2001S 20 V PNP BISS loadswitch input pulse (idealized waveform) ...
Page 12
... NXP Semiconductors 9. Package outline Fig 19. Package outline SOT96-1 (SO8) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBLS2001S [1] For further information and the availability of packing methods, see PBLS2001S_2 Product data sheet 5.0 4 ...
Page 13
... NXP Semiconductors 11. Soldering Fig 20. Reflow soldering footprint SOT96-1 (SO8) Fig 21. Wave soldering footprint SOT96-1 (SO8) PBLS2001S_2 Product data sheet 5.50 0. solder lands occupied area placement accuracy 5.50 board direction solder lands solder resist placement accurracy 0.25 occupied area Rev. 02 — ...
Page 14
... Revision history Document ID Release date PBLS2001S_2 20090824 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PBLS2001S_1 20060803 PBLS2001S_2 Product data sheet ...
Page 15
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 16
... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12 Revision history ...