UPC8112TB-E3 NEC, UPC8112TB-E3 Datasheet

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UPC8112TB-E3

Manufacturer Part Number
UPC8112TB-E3
Description
Up-Down Converters 3V Freq Dwn Convertr
Manufacturer
NEC
Datasheet

Specifications of UPC8112TB-E3

Mounting Style
SMD/SMT
Package / Case
SOT-363
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPC8112TB-E3-A
Manufacturer:
SYFER
Quantity:
12 000
Part Number:
UPC8112TB-E3-A
Manufacturer:
NEC
Quantity:
20 000
Document No. P12808EJ3V0DS00 (3rd edition)
Date Published November 2000 N CP(K)
DESCRIPTION
cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The
high impedance output of open collector. Similar ICs of the
output of emitter follower. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to
reduce your system size.
silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Excellent RF performance
• Similar conversion gain to
• Minimized carrier leakage
• High linearity
• Low current consumption
• Supply voltage
• High-density surface mounting : 6-pin super minimold package
APPLICATIONS
• 1.5 to 1.9 GHz cellular/cordless telephone (PHS, DECT, PDC1.5G and so on)
• 800 to 900 MHz cellular telephone (PDC800M and so on)
ORDER INFORMATION
μ
PC8112TB-E3-A
The
The
Remark
Part Number
μ
μ
PC8112TB is manufactured using NEC’s 20 GHz f
PC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
To order evaluation samples, please contact your local NEC sales office (Part number for sample order:
μ
PC8112TB-A).
FOR CELLULAR/CORDLESS TELEPHONE
6-pin super minimold
Package
μ
PC2757 and lower noise figure than
: IIP
: RF
: P
: I
: V
BIPOLAR ANALOG INTEGRATED CIRCUIT
IM
RF
P
CC
Caution Electro-static sensitive devices
O(sat)
O(sat)
CC
3
3
LO
LO
The mark
= 8.5 mA TYP.
= –88 dBm@P
= –7 dBm@f
= 2.7 to 3.3 V
= –80 dB@f
= –55 dB@f
= –2.5 dBm TYP.@f
= –3 dBm TYP.@f
Markings
C2K
DATA SHEET
shows major revised points.
RFin
RFin
RFin
RFin
= 1.9 GHz (reference)
= 900 MHz (reference)
= 1.9 GHz (reference)
Embossed tape 8 mm wide.
Pin 1, 2, 3 face the tape perforation side.
Qty 3kpcs/reel.
= –38 dBm, 1.9 GHz (reference)
T
RFin
NESAT™III silicon bipolar process. This process uses
RFin
μ
= 1.9 GHz
PC2757TB and
= 900 MHz
μ
PC2758
μ
Supplying Form
μ
PC2758TB feature low impedance
PC8112TB
©
μ
PC8112TB features
1997, 2000

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UPC8112TB-E3 Summary of contents

Page 1

... Part Number Package μ PC8112TB-E3-A 6-pin super minimold Remark To order evaluation samples, please contact your local NEC sales office (Part number for sample order: μ PC8112TB-A). Document No. P12808EJ3V0DS00 (3rd edition) Date Published November 2000 N CP(K) DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT μ ...

Page 2

... PIN CONNECTIONS ............................................................................................................................................ 3 2. PRODUCT LINE-UP ............................................................................................................................................. 3 3. INTERNAL BLOCK DIAGRAM ........................................................................................................................... 4 4. SYSTEM APPLICATION EXAMPLE ................................................................................................................... 4 5. PIN EXPLANATION ............................................................................................................................................. 5 6. ABSOLUTE MAXIMUM RATINGS ...................................................................................................................... 6 7. RECOMMENDED OPERATING RANGE ............................................................................................................ 6 8. ELECTRICAL CHARACTERISTICS .................................................................................................................... 6 9. STANDARD CHARACTERISTICS FOR REFERENCE ..................................................................................... 7 10. TEST CIRCUIT ..................................................................................................................................................... 7 11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD ................................. 8 12 ...

Page 3

... PIN CONNECTIONS (Top View) (Bottom View PRODUCT LINE- +25° Items No RF 900 MHz 1.5 GHz I SSB · NF SSB · Part (mA) (dB) Number μ PC2757T 5.6 10 μ PC2757TB μ PC2758T 11 9 μ PC2758TB μ PC8112T 8.5 9 μ PC8112TB Items 900 MHz 1.5 GHz 1 ...

Page 4

INTERNAL BLOCK DIAGRAM RFinput 4. SYSTEM APPLICATION EXAMPLE Digital cordless phone Low noise Tr IFoutput LOinput μ PC8112TB DEMOD. ÷N VCO PLL 0˚ φ 90˚ Data Sheet P12808EJ3V0DS00 μ PC8112TB I Q PLL I ...

Page 5

... Form the ground pattern as wide as possible and the truck length as short as possible to minimize ground impedance. Supply voltage pin. This pin should be connected with bypass capacitor (example: 1 000 pf) to minimize ground impedance. IF output pin. This output is configured with open collector of high impedance ...

Page 6

ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V CC Total Circuit Current I CC Total Power Dissipation P D Operating Ambient Temperature T A Storage Temperature T stg 7. RECOMMENDED OPERATING RANGE Parameter Symbol Supply Voltage V CC Operating ...

Page 7

STANDARD CHARACTERISTICS FOR REFERENCE = +25° 3 IFout Parameter Symbol Conversion Gain CG SSB Noise Figure SSB • Leakage at RF pin ...

Page 8

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD input GND input Component Number IF 100 MHz Matching 000 330 nH 1 EVALUATION ...

Page 9

TYPICAL CHARACTERISTICS (T circuits) 12.1 Without Signals CIRCUIT CURRENT vs. SUPPLY VOLTAGE IFout Supply Voltage V (V) CC CIRCUIT CURRENT vs. PS ...

Page 10

IF 100 MHz Matching (f = 900 MHz) RFin IF OUTPUT POWER vs. RF INPUT POWER 0 –5 –10 –15 – 900 MHz RFin – 000 MHz LOin f = 100 MHz IFout –30 ...

Page 11

CONVERSION GAIN vs. SUPPLY VOLTAGE 900 MHz RFin 000 MHz LOin f = 100 MHz IFout 3 IFout 3.5 ...

Page 12

IF 100 MHz Matching (f = 1.5 GHz) RFin IF OUTPUT POWER vs. RF INPUT POWER 5 0 –5 –10 – 1.5 GHz RFin – 1.6 GHz LOin P = –10 dBm LOin –25 f ...

Page 13

CONVERSION GAIN vs. SUPPLY VOLTAGE 1.5 GHz RFin f = 1.6 GHz LOin f = 100 MHz IFout 3 IFout 0 2 2.5 3 3.5 Supply ...

Page 14

IF 240 MHz Matching IF OUTPUT POWER vs. RF INPUT POWER 0 –5 – –40°C A – +85°C A –20 – 1.9 GHz RFin f = 1.66 GHz –30 LOin P = –10 ...

Page 15

CONVERSION GAIN vs. SUPPLY VOLTAGE 1.9 GHz RFin –40 dBm RFin f = 1.66 GHz LOin P = –10 dBm LOin f = 240 MHz IFout ...

Page 16

S-PARAMETERS 13.1 Calibrated on pin of DUT REF 1.0 Units 1 200.0 mUnits/ 62.711 Ω –224.07 Ω hp MARKER 1 500.0 MHz RF PORT 3. 1:500 MHz 62.711 Ω-j224.07 Ω ...

Page 17

... IF Output Matching ( (This S is monitored at IF connector on test circuit fixture 100 MHz MATCHING 50.277 Ω –22.559 Ω MARKER 1 100 MHz 1 START 50.000 000 MHz STOP 3 000.000 000 MHz S log MAG. 10 dB/ REF –27.655 102.366 002 MHz MARKER 1 102.366002 MHz 1 STOP 110.000 000 MHz START 90 ...

Page 18

PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 18 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet P12808EJ3V0DS00 μ PC8112TB ...

Page 19

... The DC cut capacitor must be each attached to the input and output pins. 16. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210° ...

Page 20

... NEC does not assume any liability for infringement of patents, copyrights or other intellectual property third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • ...

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