UPB1508GV NEC, UPB1508GV Datasheet - Page 11

• Manufacturer Part Number: UPB1508GV
• Description: Prescaler 3.0 GHz Prescaler
• Manufacturer: NEC

Specifications of UPB1508GV

• Mounting Style: SMD/SMT
• Package / Case: SSOP-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PB1508GV
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering method
This product should be soldered in the following recommended conditions.
*
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
For details of recommended soldering conditions for surface mounting, refer to information document
It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH.
method).
Package peak temperature: 235 C,
Hour: within 30 s. (more than 210 C),
Time: 3 times, Limited days: no.*
Package peak temperature: 215 C,
Hour: within 40 s. (more than 200 C),
Time: 3 times, Limited days: no.*
Soldering tub temperature: less than 260 C,
Hour: within 10 s.,
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 C,
Hour: within 3 s./pin,
Limited days: no.*
Soldering conditions
CC
pin.
Recommended condition symbol
Other soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
PB1508GV
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