ICM7555CN/01.112 NXP Semiconductors, ICM7555CN/01.112 Datasheet - Page 18

• Manufacturer Part Number: ICM7555CN/01.112
• Manufacturer: NXP Semiconductors
• Type: Standardr

Specifications of ICM7555CN/01.112

• # Internal Timers: 1
• Power Dissipation: 1.16W
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Operating Supply Voltage (max): 16V
• Package Type: PDIP
• High Level Output Current: -1mA
• Low Level Output Current: 3.2mA
• Pin Count: 8
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
14. Soldering of through-hole mount packages
ICM7555_2
Product data sheet
14.1 Introduction to soldering through-hole mount packages
14.2 Soldering by dipping or by solder wave
14.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Fig 19. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 02 — 3 August 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
General purpose CMOS timer
temperature
peak
stg(max)
© NXP B.V. 2009. All rights reserved.
ICM7555
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