TJA1054AT NXP Semiconductors, TJA1054AT Datasheet
TJA1054AT
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TJA1054AT Summary of contents
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... The TJA1054A is the ElectroStatic Discharge (ESD) improved version of the TJA1054. The TJA1054AT is, as the TJA1054T, pin and downwards compatible with the PCA82C252T and the TJA1053T. This means that these two devices can be replaced by the TJA1054AT or the TJA1054T with retention of all functions ...
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... NXP Semiconductors Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to V Automatic reset to differential mode if bus failure is removed Full wake-up capability during failure modes 2.3 Protections Bus pins short-circuit safe to battery and to ground Thermally protected ...
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... A local or remote wake-up event will be signalled at the transceiver pins RXD and ERR if V BAT [4] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: T where R combinations of power dissipation (P) and ambient temperature (T 4. Ordering information Table 2. Ordering information Type number Package Name TJA1054AT SO14 TJA1054AT/S900 SO14 TJA1054AU - 5. Block diagram 1 INH 7 WAKE 5 STB ...
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... RTH RTL V CC CANH CANL GND BAT TJA1054A Product data sheet 1 INH TXD 2 3 RXD TJA1054AT ERR 4 5 STB EN 6 WAKE 7 Pin description Pin Description 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs 2 transmit data input for activating the driver to the bus lines ...
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... NXP Semiconductors 7. Functional description The TJA1054A is the interface between the CAN protocol controller and the physical wires of the CAN bus (see to 125 kBd, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. ...
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... NXP Semiconductors Table 4. Failure weak termination implies a pull-down current source behavior of 75 μA typical. [1] A weak termination implies a pull-up current source behavior of 75 μA typical. [2] Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH ...
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... NXP Semiconductors 7.2 Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL ...
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... NXP Semiconductors A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level exceeding the maximum specified wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator provided the wake-up request can be read on the ERR or RXD outputs, so the ...
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... NXP Semiconductors (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is (3) Pin INH is activated after wake-up via bus input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are (5) Transitions to sleep mode: pin INH is deactivated ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V I(WAKE) I I(WAKE) V INH V RTH V RTL R RTH R RTL stg V ESD [1] All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the device. [2] Only relevant if V [3] Junction temperature in accordance with “ ...
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... NXP Semiconductors 10. Static characteristics Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Supplies (pins V and BAT supply voltage CC V supply voltage for CC(stb) forced standby mode (fail-safe) I supply current CC V battery supply voltage ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Pins RXD and ERR V HIGH-level output OH voltage on pin ERR on pin RXD V LOW-level output OL voltage on pin ERR on pin RXD Pin WAKE I LOW-level input ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter I output current on O(CANH) pin CANH I output current on O(CANL) pin CANL V detection voltage for d(CANH)(sc) short-circuit to battery voltage on pin CANH V detection voltage for ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter V output voltage on O(RTH) pin RTH I output current on O(RTL) pin RTL I pull-up current on pu(RTL) pin RTL I pull-down current on pd(RTH) pin RTH Thermal shutdown ...
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... NXP Semiconductors Table 9. Dynamic characteristics BAT ground; unless otherwise specified. Symbol Parameter t propagation delay PD(H) TXD (HIGH) to RXD (HIGH) t bus line output rise r time t bus line output fall f time t reaction time of react(sleep) goto-sleep command t disable time of TxD dis(TxD) permanent dominant ...
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... NXP Semiconductors Table 9. Dynamic characteristics BAT ground; unless otherwise specified. Symbol Parameter t failure recovery time rec n pulse-count failure det detection n number of rec consecutive pulses for failure recovery [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at T ...
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... NXP Semiconductors 12. Test information Fig 5. Test circuit for dynamic characteristics + 5 V Fig 6. Test circuit for automotive transients TJA1054A Product data sheet + 5 V INH 1 WAKE 7 TXD 2 STB TJA1054A RXD GND Termination resistors R1 (100 Ω) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω ...
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... NXP Semiconductors WAKE Fig 7. Application diagram 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1054A Product data sheet P8xC592/P8xCE598 CAN CONTROLLER CTX0 CRXO Px.x Px.x TXD ...
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... NXP Semiconductors 13. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Bare die outline Table 10. Symbol INH TXD RXD ERR STB EN WAKE RTH RTL V CC CANH CANL GND GND BAT [1] All coordinates (μm) represent the position of the center of each pad with respect to the bottom left-hand corner of the top aluminium layer (see Fig 9 ...
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... NXP Semiconductors 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Appendix 16.1 Overview of differences between the TJA1054 and the TJA1054A Table 13. Symbol V CANH V CANL V ESD Table 14. ...
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... NXP Semiconductors 17. Abbreviations Table 15. Acronym CAN EMC EME EMI ESD 18. Revision history Table 16. Revision history Document ID Release date TJA1054A v.5 20100803 • Modifications: Value of parameter V • Typing error corrected in TJA1054A_4 20070102 TJA1054A_3 20040323 (9397 750 11722) TJA1054A_2 20020211 (9397 750 09321) ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-car low-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Bus failure management 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Support for low power modes . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning ...