WG82574IT S LBAB Intel, WG82574IT S LBAB Datasheet - Page 26
WG82574IT S LBAB
Manufacturer Part Number
WG82574IT S LBAB
Description
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAB.pdf
(472 pages)
Specifications of WG82574IT S LBAB
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Compliant
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3.0
3.1
Figure 4.
Note:
26
Interconnects
PCIe
PCIe is a third generation I/O architecture that enables cost competitive, next
generation I/O solutions providing industry leading price/performance and feature
richness. It is an industry-driven specification.
PCIe defines a basic set of requirements that comprehends the majority of the targeted
application classes. High-end application requirements such as Enterprise class servers
and high-end communication platforms are delivered by a set of advanced extensions
that compliment the baseline requirements.
To guarantee headroom for future applications of PCIe, a software-managed
mechanism for introducing new, enhanced capabilities in the platform is provided.
Figure 4
Config/OS
PCIe Stack Structure
The PCIe physical layer consists of a differential transmit pair and a differential receive
pair. Full-duplex data on these two point-to-point connections is self-clocked such that
no dedicated clock signals are required.
The bandwidth of this interface increases linearly with frequency.
Protocol
Physical
Physical
Mechanical)
(electrical
S/W
Link
shows the PCIe architecture.
Point to point, serial, differential,
Point to point, serial, differential,
hot
hot
-
-
Configurable widths 1 .. 32
Configurable widths 1 .. 32
plug, inter
plug, inter
Common Base Protocol
Common Base Protocol
Advanced
Advanced
Preserve Driver Model
Preserve Driver Model
PCI.sys Compliant
PCI.sys Compliant
2.5+
2.5+
-
-
op
op
formfactors
Gb
Gb
formfactors
Xtensions
Xtensions
/s
/s
82574 GbE Controller—Interconnects
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