MC33989PEG Freescale Semiconductor, MC33989PEG Datasheet - Page 67

• Manufacturer Part Number: MC33989PEG
• Description: SBC-HS
• Manufacturer: Freescale Semiconductor

Device on Thermal Test Board
Table 37. Thermal Resistance Performance
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
Thermal Resistance
R
θ
JA
is the thermal resistance between die junction and ambient air.
R
θ
JA
Area A (mm
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
300
600
80
70
60
50
40
30
20
10
0
0
2
)
Figure 64. Device on Thermal Test Board R
0
Heat spreading area A [mm²]
°C/W
68
52
47
x
R
θJA
300
θJA
600
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
33989
67