SC16C650BIN40 NXP Semiconductors, SC16C650BIN40 Datasheet - Page 44

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SC16C650BIN40

Manufacturer Part Number
SC16C650BIN40
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SC16C650BIN40

Transmitter And Receiver Fifo Counter
Yes
Package Type
PDIP
Operating Supply Voltage (max)
5.5V
Mounting
Through Hole
Pin Count
40
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Number Of Channels
1
Lead Free Status / RoHS Status
Compliant
Philips Semiconductors
Fig 25. HVQFN32 (SOT617-1).
9397 750 14451
Product data
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT617-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
8
1
b
- - -
IEC
0.2
9
32
c
e
D
5.1
4.9
(1)
3.25
2.95
D h
e 1
D h
D
MO-220
JEDEC
1/2
0
E
5.1
4.9
e
(1)
REFERENCES
Rev. 03 — 10 December 2004
b
3.25
2.95
E h
25
16
0.5
e
17
24
JEITA
scale
- - -
B
2.5
1/2
e
UART with 32-byte FIFOs and IrDA encoder/decoder
3.5
e
e 1
w
E
v
A
e 2
M
M
C
C
3.5
e 2
A
B
0.5
0.3
L
5 mm
0.1
A
v
A 1
y 1 C
0.05
w
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
EUROPEAN
0.05
detail X
y
SC16C650B
0.1
y 1
X
C
y
ISSUE DATE
01-08-08
02-10-18
SOT617-1
c
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